Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
InPsytech presented its 3nm UCIe 3.0 high-speed interface technology at the OCP Global Summit 2025 in San Jose, demonstrating support for 3D packaging and collaboration with Alcor Micro on an Arm-based CPU platform.
Bloom Energy has partnered with Brookfield in a $5 billion agreement to deploy solid oxide fuel cell technology across AI data centers worldwide, with a European site expected to be announced later this year.
OpenAI and Broadcom have entered a multi-year collaboration to co-develop and deploy 10 gigawatts of custom AI accelerators and networking systems between 2026 and 2029. The systems will use Broadcom’s Ethernet-based connectivity solutions and be installed across OpenAI and partner data centers.
Solidion Technology has announced the PEAK Series, a next-generation UPS system built for AI data centers, featuring its proprietary 5500 battery cell with silicon-carbon anode technology. The system aims to improve energy density, reliability, and cost efficiency, with commercial availability expected in early 2026.
The European Commission announced six new AI Factories in Czechia, Lithuania, the Netherlands, Poland, Romania, and Spain, supported by over €500 million in joint investment from the EU and member states. The expansion raises the total to 19 AI Factories across 16 countries.
Microsoft Azure has introduced the NDv6 GB300 VM series, the world’s first production-scale cluster based on NVIDIA GB300 NVL72 systems, purpose-built for OpenAI’s AI workloads. The deployment integrates over 4,600 NVIDIA Blackwell Ultra GPUs connected through Quantum-X800 InfiniBand networking to accelerate large-scale AI training and inference.
Intel has unveiled its Panther Lake processors, the first built on the company’s 18A semiconductor process. The chips will enter high-volume production later this year at Intel’s Fab 52 facility in Arizona, with shipments expected to begin before the end of 2025.
Samsung is set to supply HBM4 memory for AMD's MI450 GPUs in a new deal with OpenAI, challenging NVIDIA and SK hynix's dominance in the AI semiconductor market.
ASML has announced the appointment of Marco Pieters as its new Chief Technology Officer, effective immediately, as stated in a press release by ASML Netherlands BV.
Google is investing €5 billion in Belgium over the next two years to expand its AI and cloud infrastructure, creating 300 jobs and supporting clean energy projects.
The AI chip market is expected to grow significantly, reaching $460.9 billion by 2034, driven by increased AI adoption and demand for high-performance computing.
ScaleFlux is addressing inefficiencies in AI data centers by re-engineering flash storage to boost performance, as announced in a press release.
Honeywell and LS Electric have announced a global partnership to develop power management solutions for data centers, enhancing operational efficiency and resiliency.
Elon Musk's AI startup xAI is raising $20 billion in a funding round, with Nvidia investing up to $2 billion in equity, according to Bloomberg.
Purdue University and VMS Solutions have announced a collaboration to enhance education and research in semiconductor manufacturing, aiming to address the industry's workforce gap.
scia Systems has announced new capabilities for semiconductor device manufacturing and failure analysis, showcasing innovations at SEMICON West 2025.
Lancium has secured $600 million in debt financing to expand its data center operations in Abilene, Texas, which hosts OpenAI's Stargate project.
Johnson Controls has announced a strategic investment in Accelsius, a leader in liquid cooling technology for data centers, to enhance energy efficiency and sustainability.
OpenAI has entered a strategic partnership with AMD to deploy 6 gigawatts of AMD GPUs over multiple years, starting with 1 gigawatt in 2026.
SPX FLOW is addressing the growing demand for efficient data center cooling with its APV plate heat exchangers and Johnson Pump solutions, as announced in a press release.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
