Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
VVDN Technologies has announced the launch of its AI-powered Wi-Fi 7 Access Point Reference Designs, developed in collaboration with Qualcomm Technologies, at MWC Barcelona 2025.
Telit Cinterion has launched the FE990D and FN990D, AI-powered 5G modules and data cards featuring Qualcomm's X85/82 5G Modem-RF, enhancing connectivity and performance.
Advanced Brain Methodologies Inc. (ABM) has announced the launch of the world's first Emotion Processing Unit (EPU) chip, a groundbreaking neuro-chip designed to revolutionize mental health and cognitive performance.
yieldWerx has announced a strategic partnership with Incusolution to enhance the South Korean semiconductor industry by providing localized yield management solutions.
Lenovo has introduced the ThinkEdge SE100, a compact AI inferencing server designed to bring enterprise-level AI capabilities to the edge, announced in a press release. The server is 85% smaller than traditional models, offering GPU-ready performance for diverse environments.
SoftBank, ZutaCore, and Foxconn have collaborated to implement ZutaCore's two-phase DLC technology in AI servers using NVIDIA GPUs, achieving high cooling efficiency.
Supermicro has announced plans for a third campus in Silicon Valley, expanding its manufacturing capacity to nearly 3 million square feet, according to a press release.
Hyperscale Data's subsidiary, Alliance Cloud Services, has reached an agreement to add 40 megawatts to its Michigan data center, increasing its capacity to 340 megawatts.
RADCOM Ltd. is developing a next-gen data plane analytics solution using NVIDIA BlueField-3 DPU, targeting a commercial launch in early 2026.
AGY anticipates a threefold increase in global demand for its specialty glass fibers over the next six years, driven by the growth of AI technologies.
CoreWeave is reportedly preparing for an IPO that could value the company at over $35 billion, as it continues to expand its data center capabilities.
Nullmax and Renesas have signed a strategic partnership to develop advanced driver assistance systems (ADAS) solutions, combining AI algorithms with high-performance chips.
ASUS is set to begin production of its AI POD featuring the NVIDIA GB200 NVL72 platform, with shipments scheduled for March 2025.
QuickLogic Corporation has announced a $1.1 million contract with a Defense Industrial Base company for its embedded FPGA IP, targeting GlobalFoundries' 12nm low-power process.
Socionext has announced a strategic partnership with Google Quantum AI to develop controller SoCs for next-generation quantum computing systems.
Meta is reportedly in discussions to build a new AI data center campus, with costs potentially exceeding $200 billion, according to Reuters.
Baya Systems and Semidynamics have announced a collaboration to enhance RISC-V system-on-chip development for AI, ML, and HPC applications, according to a press release.
SynaXG and Kyocera have implemented the world's first software-defined mmWave 5G vRAN on the NVIDIA AI Aerial platform, leveraging the NVIDIA GH200 Grace Hopper Superchip for enhanced AI-RAN capabilities.
Carbice has appointed Tony Fernandez-Stoll, a veteran from AMD, as Chief Revenue Officer to lead its expansion into the data center market.
Eni has signed agreements with UAE companies MGX and G42 to develop 1GW of data centers in Italy, powered by low-carbon blue energy.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
