Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
The global modular data center market could grow from $41 billion in 2026 to $93.6 billion by 2031, supported by cloud computing and AI infrastructure demand.
Nexstrom raised a $12 million seed round to commercialize its platform for growing single crystal 2D semiconductor materials on 12 inch wafers.
AEWIN will present two AI servers using AMD EPYC 9006 processors and two phase direct liquid cooling at Taiwan Expo USA in Dallas.
TransPak has opened a 2,318 square meter facility in Chonburi, Thailand, that provides packaging, assembly and logistics services for technology equipment.
The A.I. Awards named its 2026 finalists across categories covering industries, business operations, ethical AI and customized applications. Winners will be announced on October 13.
Host Digital began trading on NYSE American after completing its merger. Its first data center site has a lease covering 43 MW of critical IT load.
Clivet introduced a magnetic levitation compressor and liquid cooling systems for AI data centers at AI Infra Summit 2026.
Huawei Digital Power presented grid forming renewable energy, storage, charging and AI data center systems at IDEE 2026. The products include a 1000 VAC energy storage architecture and megawatt scale liquid cooling.
The Global Memory Innovation Forum will bring executives and technical experts to Shenzhen on September 23 for discussions about AI memory, storage, and semiconductor technology.
Huawei presented an AI data center solution that coordinates computing, power, energy storage and cooling to improve tokens per watt.
Taiwan's Industrial Technology Research Institute unveiled a silicon photonics optical engine with 3.2 Tbps of total capacity at Taiwan Innotech Expo 2026.
UnifiedBus combines more than 10 interconnect protocols to connect processors, memory and storage across Huawei SuperPoDs and AI clusters.
Buildots will provide construction monitoring across Green Mountain data center projects, including sites in Germany and Norway with more than 100 megawatts of combined capacity.
Valens Semiconductor and onsemi are developing an integrated sensor for 3 megapixel automotive cameras using the MIPI A-PHY connectivity standard.
Echola Systems launched two Dual LC OptiShare switches that let engineers share optical test equipment across AI data center network devices.
LG Energy Solution's battery energy storage system has qualified as NVIDIA DSX Ready BESS for AI factory power infrastructure.
Flexible Circuit Technologies has developed a customizable leak detection assembly for liquid cooled AI servers and high performance computing systems.
Schneider Electric research estimates that AI building optimization can reduce energy use, while liquid cooling can lower water consumption at AI data centers.
Aeonsemi introduced the Praxium family of Ethernet PHYs, with data rates up to 10 Gbps for cameras, LiDAR and network controllers in robots and autonomous vehicles.
Skanska signed an $84 million contract to build a 48 MW data center in Georgia, with construction scheduled from November 2026 to the third quarter of 2028.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
