Sep 23, 2026
Tencent Cloud Launches DataBuddy for Data and AI Workflows
Tencent Cloud launched DataBuddy, a managed workbench that uses AI agents for data engineering, governance, analytics and data science.
Chips & Data Centers
Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Oct 13
Nebius Signs Letter of Intent for VOLT Rotterdam AI Gigafactory
Oct 12
Cisco and NVIDIA Plan Open 400G Optics Specification
Oct 12
Vuzix to Show Causeway Optical Interconnect Platform for AI Data Centers
Oct 12
Microsoft to Scale Azure Maia to Multiple Gigawatts in 2027
Sep 23, 2026
Qualcomm Unveils Two Snapdragon 8 Elite Gen 6 Smartphone Chips
Qualcomm Technologies introduced the Snapdragon 8 Elite Extreme Gen 6 and Snapdragon 8 Elite Gen 6 mobile platforms for premium smartphones.
Sep 22, 2026
Ezurio Introduces BL54LM20 Modules With Edge AI
Ezurio introduced three BL54LM20 products for Bluetooth LE devices, including a module with an integrated neural processing unit. Beta samples will ship in October 2026.
Sep 22, 2026
C&D Technologies Wins Stratus Award for AI Data Center Infrastructure
C&D Technologies received a Stratus Award for its energy storage technology for AI data centers. The company makes battery systems that provide standby power for high density computing environments.
Sep 22, 2026
GS Microelectronics and Teradyne Plan Silicon Valley Chip Test Center
GS Microelectronics and Teradyne will establish a semiconductor test and evaluation center at GSME's new Silicon Valley headquarters. The center is scheduled to open in the fourth quarter of 2026.
Sep 22, 2026
MarketsandMarkets Projects Modular Data Center Market at $93.6 Billion by 2031
The global modular data center market could grow from $41 billion in 2026 to $93.6 billion by 2031, supported by cloud computing and AI infrastructure demand.
Sep 22, 2026
Nexstrom Raises $12 Million for 12 Inch Semiconductor Wafer Platform
Nexstrom raised a $12 million seed round to commercialize its platform for growing single crystal 2D semiconductor materials on 12 inch wafers.
Sep 22, 2026
AEWIN Introduces Liquid Cooled AMD EPYC 9006 AI Servers
AEWIN will present two AI servers using AMD EPYC 9006 processors and two phase direct liquid cooling at Taiwan Expo USA in Dallas.
Sep 22, 2026
TransPak Opens Semiconductor Packaging Facility in Thailand
TransPak has opened a 2,318 square meter facility in Chonburi, Thailand, that provides packaging, assembly and logistics services for technology equipment.
Sep 22, 2026
A.I. Awards Names 2026 Finalists
The A.I. Awards named its 2026 finalists across categories covering industries, business operations, ethical AI and customized applications. Winners will be announced on October 13.
Sep 22, 2026
Host Digital Begins NYSE Trading With 43 MW Data Center Lease
Host Digital began trading on NYSE American after completing its merger. Its first data center site has a lease covering 43 MW of critical IT load.
Sep 22, 2026
Clivet Debuts Magnetic Levitation Cooling Portfolio for AI Data Centers
Clivet introduced a magnetic levitation compressor and liquid cooling systems for AI data centers at AI Infra Summit 2026.
Sep 22, 2026
Huawei Shows AI Energy Systems at IDEE 2026
Huawei Digital Power presented grid forming renewable energy, storage, charging and AI data center systems at IDEE 2026. The products include a 1000 VAC energy storage architecture and megawatt scale liquid cooling.
Sep 22, 2026
GMIF 2026 Sets AI Memory and Storage Agenda for Shenzhen
The Global Memory Innovation Forum will bring executives and technical experts to Shenzhen on September 23 for discussions about AI memory, storage, and semiconductor technology.
Sep 22, 2026
Huawei presents grid interactive AI data center solution in Shanghai
Huawei presented an AI data center solution that coordinates computing, power, energy storage and cooling to improve tokens per watt.
Sep 22, 2026
ITRI Unveils 3.2 Tbps Silicon Photonics Optical Engine
Taiwan's Industrial Technology Research Institute unveiled a silicon photonics optical engine with 3.2 Tbps of total capacity at Taiwan Innotech Expo 2026.
Sep 22, 2026
Huawei Unveils UnifiedBus Architecture for AI Clusters
UnifiedBus combines more than 10 interconnect protocols to connect processors, memory and storage across Huawei SuperPoDs and AI clusters.
Sep 22, 2026
Buildots Signs Green Mountain Data Center Deal
Buildots will provide construction monitoring across Green Mountain data center projects, including sites in Germany and Norway with more than 100 megawatts of combined capacity.
Sep 22, 2026
Valens and onsemi Develop Integrated Automotive Camera Sensor
Valens Semiconductor and onsemi are developing an integrated sensor for 3 megapixel automotive cameras using the MIPI A-PHY connectivity standard.
Sep 22, 2026
Echola Launches 800G and 1.6T Optical Switches for AI Network Testing
Echola Systems launched two Dual LC OptiShare switches that let engineers share optical test equipment across AI data center network devices.
Free newsletter
Silicon Brief
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
