Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Supermicro is collaborating with AMD to present the new Helios rack scale platform at Computex. The system combines AMD Instinct MI455X GPUs and 6th Gen EPYC CPUs to support large-scale AI workloads with improved efficiency and scalability.
Supermicro has announced a new class of AI solutions featuring Arm AGI CPUs designed for agentic AI workloads, aimed at improving compute performance and energy efficiency for enterprise data centers.
ASUS announced at Computex 2026 that it is adopting the NVIDIA DSX AI Factory platform to deliver a full AI infrastructure solution, covering design, deployment, and enterprise adoption.
Schneider Electric has launched the Uniflair XCA chiller series, featuring oil-free centrifugal compressors and optimized cooling for AI data centers. The units range from 1,200 kW to 2,500 kW and use low-GWP refrigerants to enhance energy efficiency and sustainability.
Sivers Semiconductors and GlobalFoundries announced a partnership to develop silicon photonics solutions for AI datacenter infrastructure, integrating Sivers' laser arrays into GlobalFoundries' photonics platform and SCALE optical engine.
SurplusGLOBAL has received Korean patents for two technologies integrated into its SemiMarket platform, enabling automated export control and transaction matching for semiconductor equipment and parts.
ZPE Systems announced the Nodegrid Net Services Router 2U and a new NVIDIA Jetson AI Expansion Card at Cisco Live 2026. The platform combines networking, compute, AI acceleration, and out-of-band management into a single system for distributed and edge environments.
Polar, backed by H.I.G. Capital, has completed a EUR 800 million senior secured bond issue in the Nordic market, setting a record for deal size and supporting expansion of its European data center infrastructure.
OpenSpace announced it has surpassed 1,000 data center projects worldwide using its Visual Intelligence Platform to provide real time visibility into construction progress. The platform, powered by Spatial AI, helps contractors and owners manage complex builds supporting AI and hyperscale infrastructure.
A report by Grand View Research forecasts the global GPU server market to grow from $174.3 billion in 2025 to $1,545.2 billion by 2033, driven by increased demand for high-performance computing and AI workloads.
Eason Technology has established a new subsidiary, Four Ele Industrial Intelligent Tech, to focus on digital technology development in power energy, energy networks, and energy storage facilities.
PowerBank Corporation has announced a new strategic focus on AI compute infrastructure and modular data centers, aligning its energy expertise with rising electricity demand from hyperscale AI operations. The company also revealed a ticker symbol change to PBK, effective June 3, 2026.
IREN and BE Networks are using NVIDIA DSX Air to simulate and validate the design of a large AI infrastructure before deploying more than 50,000 NVIDIA Blackwell Ultra GPUs.
MediaTek and NVIDIA have jointly announced the RTX Spark, a new processor designed to power Windows 11 PCs with advanced local AI capabilities, content creation, and gaming performance. The first laptops featuring the chip will be available in fall 2026.
MSI presented its enterprise AI strategy at Computex 2026, showcasing a cloud to edge ecosystem including liquid-cooled servers, high-performance workstations, and an edge supercomputer platform for scalable AI deployment.
XCENA has raised $135 million in a Series B round to accelerate the development and deployment of its MX1 computational memory chip, which brings compute closer to memory to improve AI efficiency.
Zendure has signed a memorandum of understanding with Dutch energy management provider Sunergy to enhance residential energy optimization in the Netherlands through AI-based storage and dynamic pricing integration.
Tencent Cloud has launched three new AI products—WorkBuddy, Miora, and TokenHub—at its inaugural Cloud Day Hong Kong event, expanding its enterprise AI offerings and upgrading its infrastructure for agent-based workloads.
Arasan Chip Systems has announced its Sureboot Total 16-bit xSPI + PSRAM IP solution, which integrates controller, PHY, and software stack support for AP Memory’s Xccela PSRAM and LVpSRAM, offering high-speed and low-power memory performance for SoC designs.
Municipal Data and Power announced preparations for a $90 billion Green Energy Bond to fund AI data centers, resilient micro-power grids, and statewide infrastructure projects across New York.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
