SK hynix Showcases Advanced Memory Technology at GTC 2025
SK hynix is presenting its latest AI memory technologies, including HBM3E and SOCAMM, at GTC 2025 in San Jose, California.
Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
SK hynix is presenting its latest AI memory technologies, including HBM3E and SOCAMM, at GTC 2025 in San Jose, California.
Supermicro has announced the expansion of its enterprise AI portfolio to include support for the NVIDIA RTX PRO 6000 Blackwell Server Edition and NVIDIA H200 NVL platform, enhancing its GPU-optimized systems for AI workloads.
WEKA has announced expanded integrations with NVIDIA's AI Data Platform and introduced its Augmented Memory Grid at GTC 2025, enhancing AI infrastructure capabilities.
Nvidia has introduced two new AI supercomputers, DGX Spark and DGX Station, powered by the Grace Blackwell chip platform, at GTC 2025.
Compal Electronics has introduced its SG720-2A/OG720-2A AI server at CloudFest 2025, featuring ZutaCore's two-phase liquid cooling technology for enhanced energy efficiency.
CURRENC Group Inc. has announced plans to build a 500MW hyperscale AI data center in Johor, Malaysia, to support financial institutions' AI adoption.
Celera has announced the sampling of the first-ever analog integrated circuit (IC) designed entirely by an autonomous software platform, marking a significant milestone in the analog IC industry.
Akamai Technologies has announced a partnership with VAST Data to enhance edge AI inference capabilities, aiming to improve data-intensive AI processing with lower latency and cost.
MSI introduced its latest server platforms, including ORv3, DC-MHS, and NVIDIA MGX AI Servers, at CloudFest 2025, focusing on modularity and performance for cloud infrastructure.
MiTAC Computing Technology Corp. introduced its latest energy-efficient server platforms at CloudFest 2025, featuring AMD EPYC and Intel Xeon processors to enhance cloud and AI computing.
Engine No. 1 and Crusoe have announced a joint venture to develop large-scale data center campuses in the U.S., aimed at supporting AI compute capabilities.
Google is collaborating with MediaTek to develop new AI chips, aiming to reduce reliance on Nvidia, according to Reuters.
CoolIT Systems has introduced the CHx1500, a high-performance row-based coolant distribution unit, offering superior cooling capacity and pump pressure for AI and HPC environments.
GDS Holdings is pursuing a $3.4 billion loan to support its data center operations in Malaysia, marking its largest financing effort to date.
Compal Electronics will unveil its next-generation AI-HPC GPU servers at NVIDIA GTC 2025, featuring NVIDIA MGX architecture and the NVIDIA GH200 Grace Hopper Superchip.
CoreWeave and Bulk Infrastructure have announced a partnership to establish one of the largest NVIDIA AI deployments in Europe at the N01 Datacenter Campus in Norway, according to a press release.
Block, Inc. has become the first company in North America to deploy NVIDIA's DGX SuperPOD with DGX GB200 systems, focusing on open source AI model research.
CoolIT Systems has announced a new 4000W-ready single-phase direct liquid cooling coldplate, significantly enhancing cooling capabilities for high-performance computing.
AHEAD has announced a new 10-megawatt facility in Libertyville, Illinois, specializing in liquid-cooled infrastructure for AI and high-performance computing, according to a press release.
Huawei has announced a comprehensive upgrade to its Xinghe Intelligent Network solutions at MWC Barcelona 2025, enhancing AI-powered network capabilities across various domains.