Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
CyberTAN has introduced its Pallas Series switch platform blueprint, which combines Marvell Teralynx T100 silicon with direct chip liquid cooling for AI data centers.
Great Lakes Semiconductor has started the first project on its Great American ChipForge platform, focused on intelligent sensors for vehicle applications.
Altair Semiconductor is integrating Iridium NTN Direct into its ALT1350 and ALT1550 chipsets, combining cellular and satellite IoT connectivity without a separate satellite modem.
QuickLogic secured a six figure contract to supply embedded FPGA intellectual property for an SoC targeting battery management, motor control and industrial robotics.
Solidion says its PEAK battery system for AI data centers can reduce the footprint of uninterruptible power supplies by up to 30%. The system uses the company's silicon carbon 5500 cell.
LITEON Technology is displaying 800 VDC power distribution and liquid cooling systems for NVIDIA Vera Rubin and OCP ORv3 infrastructure at the 2026 OCP Global Summit.
SmartSens presented image sensors and computing systems for vehicle cameras, driver monitoring, occupant monitoring and surround view applications at AutoSens Europe 2026.
Delta Electronics introduced a prefabricated DC power system that combines solid state transformers, DC/DC converters and control equipment for AI data centers.
IDC projects annual spending on infrastructure recognized by the Open Compute Project will reach $800 billion in 2029 and $892 billion in 2030.
Vertiv released a guide that helps enterprises match AI workloads with deployment locations and physical infrastructure. The framework covers facility readiness, infrastructure models, and reference designs.
Lovelace makes Elemental Core available through Google Cloud Marketplace for deployment within customer cloud environments.
Global spending on equipment for 300mm chip fabs is projected to rise 31% to $149 billion in 2026 and reach $227 billion in 2029, according to SEMI.
xFusion presents liquid cooled racks, an 800V power prototype and a super node architecture for dense AI infrastructure at OCP 2026.
Global data center physical infrastructure revenue rose 27% year over year to $14 billion in the second quarter of 2026, supported by demand for AI capacity.
3C and Datalec Precision Installations have merged to create a data center infrastructure company with expected 2026 revenue above $400 million.
DayOne Data Centers increased its Malaysia financing to about US$7.2 billion for its Johor data center platform. Customer contracts now generate income from more than 1GW of capacity.
Rocket One and Virginia Commonwealth University will conduct a one year research program on magnetic memory based on skyrmions, with work beginning November 1.
American Electric Power will buy up to 1.6 GW of Mainspring Linear Generators through 2034, starting with a 190 MW first tranche for delivery from 2027.
NTT DATA is reportedly in final talks to build Anthropic its first dedicated Japan data center in Osaka, at a cost of up to about $6.3 billion, the Nikkei reported.
Ubitium raised $14 million to commercialize a processor that combines sensing, AI inference and machine control. Evaluation units for its UB410 chip are planned for 2027.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.