Chips & Data Centers

Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.

DapuStor Highlights AI-Optimized SSD Portfolio at Computex 2026

DapuStor showcased its enterprise SSD lineup designed for AI workloads at Computex 2026, featuring high-capacity and low-latency models in collaboration with Advantech, Inventec, and Western Digital.

June 10, 2026

NOVOSENSE Highlights IC Innovations Across Automotive, Industrial, and AI Data Center Power at PCIM Europe 2026

NOVOSENSE Microelectronics showcased its latest IC technologies at PCIM Europe 2026 in Nuremberg, featuring advancements in gate drivers, isolation devices, sensors, and motor drivers for automotive, industrial, and AI data center applications.

June 10, 2026

Newmark Arranges $975 Million Financing for Northern Virginia Data Center

Newmark Group has arranged $975 million in balance sheet financing for Project Helios, a newly built data center in Northern Virginia. The financing was provided by Blue Owl and supports a facility fully leased to a major cloud service provider.

June 09, 2026

STAK Inc. to Form U.S. Subsidiary for Modular Gas Power Systems Serving AI Data Centers

STAK Inc. has signed a memorandum of understanding to establish a majority-owned U.S. subsidiary that will develop and commercialize modular gas-to-electricity generation systems for AI data centers and other high-energy applications across North America.

June 09, 2026

Wesco to Acquire Singapore-Based Newark Engineering Group for $136 Million

Wesco International has signed an agreement to acquire Newark Engineering Group, a Singapore-based provider of data center cooling and lifecycle services, for about $136 million USD. The deal expands Wesco's presence in Southeast Asia and strengthens its data center service portfolio.

June 09, 2026

Innodisk Expands Qualcomm Dragonwing Edge AI Lineup at Computex 2026

Innodisk showcased its full Qualcomm Dragonwing edge AI lineup at Computex 2026, introducing modules, starter kits, and deployment-ready systems powered by Dragonwing IQ8 through IQ10 processors.

June 08, 2026

Solidion Technology Granted Seven New Patents for Composite Anode Materials

Solidion Technology has received seven new U.S. patents for its composite anode materials used in lithium batteries, expanding its portfolio to 130 patents. The technology aims to improve energy density and lower costs for applications in AI data centers, humanoid robots, drones, electric vehicles, and space systems.

June 08, 2026

EPAM and TGS Deploy Cloud-Based Imaging Platform on AWS for Energy Sector

EPAM Systems and TGS have deployed the TGS Imaging AnyWare platform on Amazon Web Services to modernize seismic imaging workflows and enable AI-driven subsurface data operations for energy companies.

June 08, 2026

USD.AI Provides $98.1 Million Financing for Duos Edge AI GPU Deployment Managed by Hydra Host

USD.AI has provided $98.1 million in asset-backed debt financing to support Duos Edge AI’s deployment of 2,304 NVIDIA B300 GPUs, which will be managed by Hydra Host through its Brokkr AI Factory Operating System.

June 08, 2026

ROHM SiC MOSFET Adopted in Battery Backup Units for AI Servers

ROHM Semiconductor announced that its 750V SiC MOSFET has been adopted in battery backup units for AI server power supplies, supporting the industry's shift toward high-voltage direct current architectures.

June 08, 2026

CHG EnSOL Launches AIDC Photovoltaic Modules for AI Data Centers

CHG EnSOL introduced its ENSOL-AIDC photovoltaic modules at the SNEC 2026 conference in Shanghai, designed to supply clean energy to AI data centers. The company also announced a partnership with Suzhou Heimian Optoelectronics to develop perovskite-silicon tandem solar cells for space applications.

June 05, 2026

Solidion Technology Unveils Battery Platform for Extreme Space Environments

Solidion Technology has introduced a patented battery platform designed for satellites, AI data centers in Low Earth Orbit, and future lunar missions. The system uses graphene to manage temperature and radiation exposure, ensuring reliable operation from minus 80 to plus 60 degrees Celsius.

June 05, 2026

REPT BATTERO Unveils Sodium and Lithium Batteries at SNEC 2026

REPT BATTERO introduced two new energy storage battery cells at the SNEC 2026 exhibition in Shanghai: a 320 Ah sodium-ion cell for large-scale energy storage and an 85 Ah lithium-ion battery designed for AI data centers.

June 05, 2026

Hut 8 Prices $4.25 Billion Notes for Texas Data Center Project

Hut 8 has priced a $4.25 billion offering of senior secured notes to fund construction of a 352-megawatt data center in Nueces County, Texas. The notes, bearing interest at 6.129% and maturing in 2042, will finance the Beacon Point facility and related infrastructure.

June 05, 2026

ASRock Rack Introduces NVIDIA Vera CPU Systems at COMPUTEX 2026

ASRock Rack unveiled its new AI infrastructure lineup at COMPUTEX 2026, featuring the 2UXGM-VERA2 system powered by the NVIDIA Vera CPU and showcasing liquid-cooled AI servers for data centers and edge deployments.

June 04, 2026

Autodesk Signs Collaboration Agreement with AWS for Cloud and AI Integration

Autodesk has entered a strategic collaboration agreement with Amazon Web Services to expand cloud-based design and make solutions, with Autodesk products soon available through AWS Marketplace.

June 04, 2026

Wiwynn and Shinwa Controls Partner on Data Center Liquid Cooling Systems

Wiwynn and Shinwa Controls have formed a strategic collaboration to deliver liquid cooling infrastructure for data centers, following three years of joint engineering and validation work.

June 04, 2026

HCM Invited to Choose France Summit to Strengthen Taiwan-France Energy Cooperation

HCM, a Taiwan-based manufacturer of lithium manganese iron phosphate cathode materials, was invited to the Choose France Summit at Versailles, marking its first participation and signaling growing collaboration between Taiwan and France in energy, defense, and aerospace sectors.

June 04, 2026

Rivvor Unveils Sub-THz Wireless Platform for AI Data Centers

Rivvor announced progress on its sub-THz wireless interconnect platform designed to replace short-range cabling in high-density AI data centers. The technology achieved multi-Gbps data transfer and nanosecond-scale latency in lab tests, with production silicon targeted for 2028.

June 03, 2026

Lovable Expands Collaboration with Google Cloud to Scale AI Software Creation

Lovable has expanded its partnership with Google Cloud to integrate Gemini models and AI infrastructure, enabling large scale software creation and improved enterprise security.

June 03, 2026

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