Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Microsoft is exploring high-temperature superconductors to improve energy efficiency and power capacity in its data centers, reducing transmission losses and physical infrastructure needs.
Zettabyte and LITEON Technology have announced a research and development collaboration to build the Ultra Edge Pod, a distributed edge AI inferencing platform designed for deployment at cell tower and network-proximate locations.
OpenAI has introduced GPT-5.3-Codex-Spark, a lightweight version of its Codex coding model powered by Cerebras’ Wafer Scale Engine 3 chip. The model focuses on fast inference for real-time coding and is available in research preview for ChatGPT Pro users.
EPRI has announced a collaboration with Nvidia, Prologis, and InfraPartners to create smaller, distributed data centers designed for AI inference workloads. The initiative will test micro data centers near utility substations to improve efficiency and grid reliability.
Cisco has announced the Silicon One G300 chip, along with new N9000 and 8000 systems, optics, and management tools aimed at improving AI data center efficiency and scalability.
US Signal is constructing over 1,000 miles of new high-density fiber and conduit infrastructure across Ohio and Indiana, connecting core and edge data centers to support AI and cloud workloads. About 30 percent of the network is complete, with full completion expected by early 2027.
DG Matrix and Exowatt have announced a strategic partnership to integrate solid-state transformer technology into Exowatt’s renewable energy systems, enabling gigawatt-scale, dispatchable power for AI data centers.
SuperX Industries Co., Ltd. has signed a Memorandum of Understanding with Digital Dynamic Inc., eole Inc., and Woodman Inc. to co-develop modular AI data centers across Japan, starting with a pilot project in Mie Prefecture.
Semidynamics has introduced its 3nm AI inference silicon and a vertically integrated stack covering chips, boards, and rack-scale systems for next-generation data centers.
Johnson Controls has introduced the YORK YDAM, an air-cooled magnetic bearing centrifugal chiller designed for high-density, multistory data centers and AI factories. The system delivers up to 3.5MW of cooling with 20% higher capacity density than comparable products.
Core AI Holdings, Inc. has signed a memorandum of understanding with CSPM Resources SDN BHD to pursue AI-ready data center projects in Malaysia, aiming to retrofit existing facilities into Tier 3 or Tier 4 AI-capable sites within 12 months.
Amazon plans to invest $200 billion in artificial intelligence, robotics, and infrastructure this year, marking a major increase from last year's spending. The company also reported $213 billion in quarterly revenue, with AWS showing its fastest growth in over three years.
Born.ai, operating under EYWA LLC, announced the availability of its distributed computing patent portfolio for immediate license or acquisition. The assets cover technologies enabling large-scale AI workloads across federated networks of independent nodes.
Johnson Controls has introduced a Reference Design Guide Series for 1-gigawatt AI data centers, providing detailed thermal architectures for water-cooled, air-cooled, and absorption chiller systems integrated with advanced building controls.
SpaceX has acquired Elon Musk’s artificial intelligence company xAI, merging the two firms to develop orbital data centers powered by solar energy and launched via Starship.
Oracle announced plans to raise between $45 and $50 billion in 2026 through a mix of debt and equity financing to expand its Oracle Cloud Infrastructure capacity for major clients including AMD, Meta, NVIDIA, OpenAI, TikTok, and xAI.
FPT Corporation has announced the creation of the FPT Advanced Semiconductor Testing and Packaging Plant in Bac Ninh Province, marking Vietnam’s first fully Vietnamese-owned facility of its kind. The plant will enhance the country’s semiconductor ecosystem and provide training for local engineers.
ASML reported a record €13 billion in new orders for the fourth quarter of 2025, signaling continued strong demand for advanced chipmaking equipment driven by artificial intelligence infrastructure growth. The company posted €32.7 billion in annual net sales and announced plans to cut 1,700 jobs.
Blaize and Nokia have signed a Memorandum of Understanding to collaborate on edge and hybrid AI inference solutions across Asia-Pacific, combining Blaize's AI platform with Nokia's networking and automation systems.
Lucend, formerly known as Coolgradient, has raised $3.3 million in seed funding led by Remarkable Ventures Climate to expand its Transparent AI platform for data center optimization in the U.S.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
