Chips & Data Centers

Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.

MSI Unveils Cloud to Edge AI Ecosystem at Computex 2026

MSI presented its enterprise AI strategy at Computex 2026, showcasing a cloud to edge ecosystem including liquid-cooled servers, high-performance workstations, and an edge supercomputer platform for scalable AI deployment.

June 01, 2026

XCENA Raises $135 Million to Advance Memory Centric AI Chips

XCENA has raised $135 million in a Series B round to accelerate the development and deployment of its MX1 computational memory chip, which brings compute closer to memory to improve AI efficiency.

May 30, 2026

Zendure and Sunergy Partner to Advance Smart Home Energy Management in the Netherlands

Zendure has signed a memorandum of understanding with Dutch energy management provider Sunergy to enhance residential energy optimization in the Netherlands through AI-based storage and dynamic pricing integration.

May 29, 2026

Tencent Cloud Introduces Global AI Tools and Infrastructure Upgrades at Hong Kong Summit

Tencent Cloud has launched three new AI products—WorkBuddy, Miora, and TokenHub—at its inaugural Cloud Day Hong Kong event, expanding its enterprise AI offerings and upgrading its infrastructure for agent-based workloads.

May 29, 2026

Arasan Chip Systems Introduces 16-Bit Sureboot Total xSPI + PSRAM IP Solution

Arasan Chip Systems has announced its Sureboot Total 16-bit xSPI + PSRAM IP solution, which integrates controller, PHY, and software stack support for AP Memory’s Xccela PSRAM and LVpSRAM, offering high-speed and low-power memory performance for SoC designs.

May 29, 2026

Municipal Data and Power Plans $90 Billion Green Energy Bond for New York AI Infrastructure

Municipal Data and Power announced preparations for a $90 billion Green Energy Bond to fund AI data centers, resilient micro-power grids, and statewide infrastructure projects across New York.

May 29, 2026

Lenovo to Integrate Frore Systems AirJet Mini Cooling Chip in Future Devices

Lenovo will incorporate Frore Systems' AirJet Mini solid-state cooling chip in upcoming products through a collaboration under Lenovo's Innovation Accelerator program. The AirJet Mini G2 replaces traditional fans and heatsinks, enabling more compact and silent device designs.

May 28, 2026

Reducto Named to Redpoint Ventures' 2026 InfraRed 100 List

Reducto has been recognized by Redpoint Ventures on its 2026 InfraRed 100 list, which highlights private companies building key infrastructure for AI innovation.

May 28, 2026

Verda Deploys Supermicro Systems for NVIDIA Blackwell AI Cloud Infrastructure in Europe

Verda has selected Supermicro's NVIDIA GPU-accelerated rack-scale systems to build a new AI cloud infrastructure across Europe, using liquid-cooled NVIDIA Blackwell systems powered by renewable energy.

May 28, 2026

Elisa Estonia Deploys AI Battery Optimization to Support National Grid

Elisa Estonia has implemented Elisa Industriq’s Gridle battery optimization system across its mobile network, enabling its backup batteries to assist in balancing Estonia’s electricity grid while improving network resilience and reducing energy costs.

May 28, 2026

AuthenX to Demonstrate Detachable 2D FAU Technology at Computex 2026

AuthenX Inc. will showcase its Detachable 2D Fiber Array Unit at Computex Taipei 2026, introducing a meta-optics based solution aimed at simplifying co-packaged optics manufacturing and scaling for AI and high-performance computing clusters.

May 28, 2026

ASPEED and Lattice Form Partnership for New Datacenter Control Architecture

ASPEED Technology and Lattice Semiconductor have announced a strategic partnership to develop flexible control systems for datacenter management, introducing the AST1840 Satellite Management Controller as the first product from their collaboration.

May 28, 2026

Centamil Introduces 5,000W Hayagreeva HEx Cold Plate for AI Data Centers

Centamil has launched the Hayagreeva HEx, a copper-matrix cold plate designed for AI data center infrastructure, capable of dissipating over 5,000 watts of heat with a thermal resistance of 0.005°C/W.

May 28, 2026

Flexential Acquires Two Data Centers in Hillsboro, Oregon

Flexential has acquired its Hillsboro 4 and Hillsboro 5 data centers in Oregon, marking the largest real estate transaction in the company’s history. The purchase expands its ownership to 496,000 square feet across 20 acres in Hillsboro, strengthening its position in a major US data center market.

May 28, 2026

Hahn and Escalent Release Data Center Communications Playbook to Address Public Opposition

Hahn and Escalent have published a Data Center Communications Playbook following a 13-state survey revealing declining public trust in data centers and identifying key issues driving opposition, including electricity costs and AI-related concerns.

May 28, 2026

Wiwynn and Partners to Showcase Co-Packaged Optics at Computex 2026

Wiwynn announced it will demonstrate new co-packaged optics technologies at Computex 2026 in Taipei, collaborating with Ayar Labs, Global Unichip Corp., and others to advance optical interconnects for AI data centers.

May 28, 2026

Synopsys Expands AI and Multi-Die Design Collaboration with Samsung Foundry

Synopsys announced new AI powered design flows, certified IP, and silicon based test capabilities developed with Samsung Foundry for advanced 2nm and 4nm processes, aiming to improve power, performance, and test efficiency for AI and multi-die designs.

May 28, 2026

Compal Electronics and GMI Cloud Partner on AI Infrastructure Deployment

Compal Electronics and GMI Cloud have announced a collaboration to develop large scale AI infrastructure optimized for inference and emerging agentic AI workloads. The partnership will be showcased at COMPUTEX 2026, featuring Compal’s SGX30-2 server platform supporting NVIDIA HGX B300.

May 27, 2026

Pump.co Expands Free Platform to Include AI Cost Optimization

Pump.co has expanded its free cloud savings platform to help companies manage and reduce AI-related infrastructure costs across multiple cloud providers.

May 27, 2026

WhiteFiber Secures 100 Million Dollar Loan Facility from Bit Digital

WhiteFiber has entered a 100 million dollar delayed draw term loan facility with Bit Digital Capital to support near term growth in its data centers and cloud services. The financing may increase to 150 million dollars upon mutual agreement.

May 27, 2026

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