Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
MSI presented its enterprise AI strategy at Computex 2026, showcasing a cloud to edge ecosystem including liquid-cooled servers, high-performance workstations, and an edge supercomputer platform for scalable AI deployment.
XCENA has raised $135 million in a Series B round to accelerate the development and deployment of its MX1 computational memory chip, which brings compute closer to memory to improve AI efficiency.
Zendure has signed a memorandum of understanding with Dutch energy management provider Sunergy to enhance residential energy optimization in the Netherlands through AI-based storage and dynamic pricing integration.
Tencent Cloud has launched three new AI products—WorkBuddy, Miora, and TokenHub—at its inaugural Cloud Day Hong Kong event, expanding its enterprise AI offerings and upgrading its infrastructure for agent-based workloads.
Arasan Chip Systems has announced its Sureboot Total 16-bit xSPI + PSRAM IP solution, which integrates controller, PHY, and software stack support for AP Memory’s Xccela PSRAM and LVpSRAM, offering high-speed and low-power memory performance for SoC designs.
Municipal Data and Power announced preparations for a $90 billion Green Energy Bond to fund AI data centers, resilient micro-power grids, and statewide infrastructure projects across New York.
Lenovo will incorporate Frore Systems' AirJet Mini solid-state cooling chip in upcoming products through a collaboration under Lenovo's Innovation Accelerator program. The AirJet Mini G2 replaces traditional fans and heatsinks, enabling more compact and silent device designs.
Reducto has been recognized by Redpoint Ventures on its 2026 InfraRed 100 list, which highlights private companies building key infrastructure for AI innovation.
Verda has selected Supermicro's NVIDIA GPU-accelerated rack-scale systems to build a new AI cloud infrastructure across Europe, using liquid-cooled NVIDIA Blackwell systems powered by renewable energy.
Elisa Estonia has implemented Elisa Industriq’s Gridle battery optimization system across its mobile network, enabling its backup batteries to assist in balancing Estonia’s electricity grid while improving network resilience and reducing energy costs.
AuthenX Inc. will showcase its Detachable 2D Fiber Array Unit at Computex Taipei 2026, introducing a meta-optics based solution aimed at simplifying co-packaged optics manufacturing and scaling for AI and high-performance computing clusters.
ASPEED Technology and Lattice Semiconductor have announced a strategic partnership to develop flexible control systems for datacenter management, introducing the AST1840 Satellite Management Controller as the first product from their collaboration.
Centamil has launched the Hayagreeva HEx, a copper-matrix cold plate designed for AI data center infrastructure, capable of dissipating over 5,000 watts of heat with a thermal resistance of 0.005°C/W.
Flexential has acquired its Hillsboro 4 and Hillsboro 5 data centers in Oregon, marking the largest real estate transaction in the company’s history. The purchase expands its ownership to 496,000 square feet across 20 acres in Hillsboro, strengthening its position in a major US data center market.
Hahn and Escalent have published a Data Center Communications Playbook following a 13-state survey revealing declining public trust in data centers and identifying key issues driving opposition, including electricity costs and AI-related concerns.
Wiwynn announced it will demonstrate new co-packaged optics technologies at Computex 2026 in Taipei, collaborating with Ayar Labs, Global Unichip Corp., and others to advance optical interconnects for AI data centers.
Synopsys announced new AI powered design flows, certified IP, and silicon based test capabilities developed with Samsung Foundry for advanced 2nm and 4nm processes, aiming to improve power, performance, and test efficiency for AI and multi-die designs.
Compal Electronics and GMI Cloud have announced a collaboration to develop large scale AI infrastructure optimized for inference and emerging agentic AI workloads. The partnership will be showcased at COMPUTEX 2026, featuring Compal’s SGX30-2 server platform supporting NVIDIA HGX B300.
Pump.co has expanded its free cloud savings platform to help companies manage and reduce AI-related infrastructure costs across multiple cloud providers.
WhiteFiber has entered a 100 million dollar delayed draw term loan facility with Bit Digital Capital to support near term growth in its data centers and cloud services. The financing may increase to 150 million dollars upon mutual agreement.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
