Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
ABB and NVIDIA have announced a collaboration to develop advanced AI data centers with high-efficiency power delivery systems. ABB will focus on scalable electrification solutions to support NVIDIA’s 800-volt architecture for faster, more efficient energy transfer.
Advantech has introduced the AOM-5721, a SMARC-based edge AI computer-on-module featuring Qualcomm’s Dragonwing QCS6490 SoC, designed for industrial, commercial, and medical applications.
Google announced a $15 billion investment to establish India's first AI hub and a gigawatt-scale data center campus in Visakhapatnam, Andhra Pradesh, in partnership with AdaniConneX and Airtel. The project will expand digital infrastructure, clean energy capacity, and subsea connectivity over the next five years.
ASUS unveiled its AI Factory and XA NB3I-E12 AI servers powered by NVIDIA HGX B300 systems at the 2025 OCP Global Summit, highlighting solutions for enterprise and cloud AI workloads.
GIGABYTE has announced that its AI TOP ATOM personal supercomputer, featuring the NVIDIA Grace Blackwell GB10 Superchip, will be available globally from October 15. The compact system delivers up to 1 PetaFLOP of FP4 AI performance and supports models with up to 200 billion parameters.
Wiwynn introduced a double-wide rack architecture at the OCP Global Summit 2025 to support larger, high-power AI accelerators with integrated HVDC power and advanced liquid cooling systems.
Compal Electronics presented new CXL-based memory pooling and liquid cooling server technologies at the 2025 OCP Global Summit, highlighting its collaboration with NVIDIA and focus on scalable AI data center infrastructure.
Acbel introduced its Ruby-level power rack system at the OCP Global Summit 2025 in San Jose, offering scalable and resilient power solutions for hyperscale AI and HPC workloads.
Fabric8Labs and Wiwynn will present advanced Electrochemical Additive Manufacturing (ECAM) cold plate solutions for AI data center cooling at the OCP Global Summit 2025 in San Jose.
Planera has raised $8 million in new funding to expand its visual scheduling platform for data center construction, bringing total funding to $26.5 million.
Flex announced a globally manufactured, fully integrated data center platform at the OCP Global Summit, designed to accelerate AI and high-performance computing infrastructure deployments by up to 30%.
InPsytech presented its 3nm UCIe 3.0 high-speed interface technology at the OCP Global Summit 2025 in San Jose, demonstrating support for 3D packaging and collaboration with Alcor Micro on an Arm-based CPU platform.
Bloom Energy has partnered with Brookfield in a $5 billion agreement to deploy solid oxide fuel cell technology across AI data centers worldwide, with a European site expected to be announced later this year.
OpenAI and Broadcom have entered a multi-year collaboration to co-develop and deploy 10 gigawatts of custom AI accelerators and networking systems between 2026 and 2029. The systems will use Broadcom’s Ethernet-based connectivity solutions and be installed across OpenAI and partner data centers.
Solidion Technology has announced the PEAK Series, a next-generation UPS system built for AI data centers, featuring its proprietary 5500 battery cell with silicon-carbon anode technology. The system aims to improve energy density, reliability, and cost efficiency, with commercial availability expected in early 2026.
The European Commission announced six new AI Factories in Czechia, Lithuania, the Netherlands, Poland, Romania, and Spain, supported by over €500 million in joint investment from the EU and member states. The expansion raises the total to 19 AI Factories across 16 countries.
Microsoft Azure has introduced the NDv6 GB300 VM series, the world’s first production-scale cluster based on NVIDIA GB300 NVL72 systems, purpose-built for OpenAI’s AI workloads. The deployment integrates over 4,600 NVIDIA Blackwell Ultra GPUs connected through Quantum-X800 InfiniBand networking to accelerate large-scale AI training and inference.
Intel has unveiled its Panther Lake processors, the first built on the company’s 18A semiconductor process. The chips will enter high-volume production later this year at Intel’s Fab 52 facility in Arizona, with shipments expected to begin before the end of 2025.
Samsung is set to supply HBM4 memory for AMD's MI450 GPUs in a new deal with OpenAI, challenging NVIDIA and SK hynix's dominance in the AI semiconductor market.
ASML has announced the appointment of Marco Pieters as its new Chief Technology Officer, effective immediately, as stated in a press release by ASML Netherlands BV.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
