Chips & Data Centers

Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.

Sep 22, 2026

LG Energy Solution Battery System Qualifies as NVIDIA DSX Ready BESS

LG Energy Solution's battery energy storage system has qualified as NVIDIA DSX Ready BESS for AI factory power infrastructure.

Sep 22, 2026

FCT Develops Flexible Leak Detection Assembly for AI Servers

Flexible Circuit Technologies has developed a customizable leak detection assembly for liquid cooled AI servers and high performance computing systems.

Sep 22, 2026

Schneider Electric Says AI Can Cut Building Energy Use by Up to 22%

Schneider Electric research estimates that AI building optimization can reduce energy use, while liquid cooling can lower water consumption at AI data centers.

Sep 22, 2026

Aeonsemi Unveils Praxium Ethernet PHYs for Robots and Autonomous Vehicles

Aeonsemi introduced the Praxium family of Ethernet PHYs, with data rates up to 10 Gbps for cameras, LiDAR and network controllers in robots and autonomous vehicles.

Sep 22, 2026

Skanska Signs $84 Million Georgia Data Center Contract

Skanska signed an $84 million contract to build a 48 MW data center in Georgia, with construction scheduled from November 2026 to the third quarter of 2028.

Sep 19, 2026

Virginia Proposes Data Center Rules and Creates AI Task Force

Virginia Governor Abigail Spanberger proposed new data center rules covering local approval, electricity costs, water use and grid access. An executive order also creates a task force focused on AI risks.

Sep 19, 2026

House Passes Bill to Shield Ratepayers From Data Center Power Costs

The House passed the Ratepayer Protection Act by a vote of 417 to 3. The bill would have large data centers cover the added electricity and infrastructure costs needed to serve them.

Sep 19, 2026

Laminar Joins L'Oreal Sustainability Accelerator

Laminar was selected for the second L'AcceleratOR cohort, where it will work with L'Oreal and the University of Cambridge on manufacturing pilot projects.

Sep 19, 2026

Dnotitia Begins Testing VDPU ASIC Samples

Dnotitia is testing its first VDPU ASIC samples and plans to begin evaluations using the chips in the fourth quarter of 2026.

Sep 19, 2026

Nscale Files for US Initial Public Offering

Nscale filed a registration statement with the SEC for a proposed initial public offering and applied to list on the New York Stock Exchange under the ticker NSCL.

Sep 19, 2026

CleanSpark Prices $2.276 Billion Notes for Sandersville Data Center

CleanSpark subsidiary CSDC Finance I priced $2.276 billion of senior secured notes to fund the Sandersville data center. The notes carry a 7.875% interest rate and mature in 2031.

Sep 18, 2026

Santa Cruz County Rejects Public Vote Proposal for AI Data Centers

Santa Cruz County supervisors rejected a proposal to require voter approval for zoning changes that would allow AI data centers in unincorporated areas.

Sep 18, 2026

Utility Survey Finds 78% Deploying AI for Interconnection Demand

A National Grid Partners survey finds 78% of US utility innovation leaders are deploying at least one AI application to manage interconnection demand.

Sep 18, 2026

SK hynix Launches Venture Capital Brand for AI Investments

SK hynix has launched SK hynix Ventures in Silicon Valley to invest in AI computing, data centers, system software and optical interconnect technologies.

Sep 17, 2026

Delta Develops Power and Cooling Infrastructure for NVIDIA DSX AI Factories

Delta Electronics is developing integrated power and cooling infrastructure for AI factories based on NVIDIA DSX, including 800 VDC power delivery and liquid cooling systems.

Sep 17, 2026

Saturn Cloud Integrates NVIDIA Run:ai for GPU Inference Services

Saturn Cloud has integrated NVIDIA Run:ai and the NVIDIA DSX AI Factory Platform into its inference platform. Infrastructure operators can offer services billed per token alongside GPU capacity rentals, managed fine tuning and dedicated capacity.

Sep 17, 2026

NovoLINC Launches MaxLINC Thermal Material for AI Chips

NovoLINC has launched MaxLINC, a thermal interface material for high power AI chips that offers thermal resistance as low as 0.7 mm²•K/W.

Sep 17, 2026

Teledyne LeCroy Releases PCIe 7.0 Protocol Exerciser

The Summit Z74 generates controlled PCIe 7.0 protocol traffic for device validation and debugging. It can also pair with the Summit M616 Protocol Analyzer.

Sep 17, 2026

XKL Adds Low Latency Optical Links for Distributed AI

XKL introduced MediaLight data center interconnect capabilities for distributed AI and high performance computing. The systems provide Layer 1 optical transport with latency below 5 microseconds.

Sep 17, 2026

Sentry AI deploys 100th SolarGuard security trailer

Sentry AI has deployed its 100th SolarGuard mobile security unit at a construction site. The system combines solar powered hardware, cloud AI, and continuous monitoring by remote security agents.

Free newsletter

Silicon Brief

Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.