Rivvor Unveils Sub-THz Wireless Platform for AI Data Centers

Rivvor announced in a press release major progress on its sub-THz wireless interconnect platform for AI data centers and corporate high-performance computing. The system introduces wireless connectivity inside high-density AI racks, complementing existing copper and optical interconnects.

Recent laboratory results confirmed 1600-nanosecond round-trip latency and error-free multi-gigabit data transfer over peer-to-peer millimeter-wave links. The company is developing production ASICs targeting nanosecond-scale latency and throughput up to 1.6 terabits per second, with inter-rack paths expected to reach 50 terabits per second. First silicon is planned for early 2028.

The platform includes two architectures built on a single chipset. The Direct Path Architecture uses steerable sub-THz beams to reconfigure network paths inside standard racks in under a millisecond. The Bounded Electromagnetic Corridor architecture converts rack structures into high-capacity data channels, scalable to petabit-class bandwidth per rack. Both designs will be deployed through Rivvor’s Wireless Network Interface Cards and rack-level controllers.

Rivvor’s approach removes short-range cables, freeing rack space and enabling modular assembly and reconfiguration. The company plans to publicly demonstrate the technology at the Open Compute Project Global Summit in San Jose, California, in October 2026.