Chips & Data Centers

Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.

Meta Signs Deal for Space-Based Solar Power from Overview Energy

Meta has signed an agreement with Overview Energy to receive up to one gigawatt of solar energy beamed from space to power its AI data centers, with commercial delivery expected in 2030.

April 28, 2026

Luxshare-ICT Expands Role in AI Data Center Infrastructure

Luxshare-ICT announced it is broadening its involvement in AI data center infrastructure, focusing on interconnect, power, and thermal management systems as computing density and energy demands rise.

April 28, 2026

Refroid Technologies Named Emerging Leader in Data Center Liquid Cooling by MarketsandMarkets

Refroid Technologies has been recognized as an Emerging Leader in the data center liquid cooling market by MarketsandMarkets' 360Quadrants platform, citing its advanced immersion and direct-to-chip cooling systems for AI and HPC workloads.

April 28, 2026

Aramark Launches Nexus Platform for AI Data Centers

Aramark has introduced Aramark Nexus, a new platform providing integrated hospitality and workforce support services for hyperscale AI data centers. The company has also signed a multi-year agreement with a major global hyperscaler to deliver these services across multiple sites.

April 28, 2026

Nano Labs and ALT5 Sigma Sign MOU to Explore AI Data Centers and Agent Cloud in North America

Nano Labs and ALT5 Sigma Corporation have signed a non-binding memorandum of understanding to evaluate collaboration on AI data centers, an Agent Cloud platform, and AI-native payment systems in North America.

April 28, 2026

Q.ANT Expands to U.S. with Austin Headquarters and New CTO

Q.ANT has opened its U.S. headquarters in Austin, Texas, and named semiconductor veteran Bruno Spruth as Chief Technology Officer to lead its North American operations and drive photonic computing development.

April 28, 2026

BTC Digital Completes Georgia Facility and Begins Shift to AI Computing

BTC Digital Ltd. has completed construction of its 10 megawatt computing infrastructure in Georgia and announced its transformation into an AI computing platform, with plans to expand capacity up to 25 megawatts.

April 28, 2026

IDrive e2 Opens Tokyo Storage Region for AI and Data Workloads

IDrive e2 has launched a new storage region in Tokyo, marking its first in Japan and expanding its global network to enhance performance and accessibility for AI and data-intensive applications.

April 28, 2026

Oracle and BorderPlex to Power Project Jupiter with Bloom Energy Fuel Cells

Oracle and BorderPlex Digital Assets will use Bloom Energy fuel cells to power Project Jupiter, a large AI data center campus in New Mexico, replacing gas turbines and diesel generators with a low-emission microgrid.

April 28, 2026

Marvell Acquires Polariton Technologies to Expand Optical Connectivity Portfolio

Marvell Technology has acquired Swiss silicon photonics startup Polariton Technologies to strengthen its optical interconnect capabilities and advance performance scaling to 3.2T and beyond. Financial details of the transaction were not disclosed.

April 27, 2026

BT and Nscale to Develop UK Sovereign AI Data Centres with NVIDIA Infrastructure

BT and Nscale announced plans to build sovereign AI data centres across the UK powered by NVIDIA infrastructure, expanding the country's AI compute capacity and supporting government goals for digital sovereignty.

April 24, 2026

Munters Wins 2 Billion SEK Order for Modular AI Cooling System in the US

Munters has received a 2 billion SEK order from a US colocation data center provider for a modular cooling platform designed for AI infrastructure. Deliveries will begin in early 2027 and continue through the first quarter of 2028.

April 24, 2026

Arasan Chip Systems Releases UFS 5.0 Host Controller IP

Arasan Chip Systems has announced the immediate availability of its UFS 5.0 host controller IP, supporting data rates up to 46.694 Gbps and designed for advanced mobile and AI edge applications.

April 24, 2026

M31 Completes eUSB2V2 Tapeout on TSMC N2P Process

M31 Technology has completed the tapeout of its eUSB2V2 interface IP on TSMC's N2P 2 nm process, marking a milestone in advanced node interface development focused on high-speed, low-power connectivity for AI, HPC, and mobile applications.

April 23, 2026

Latin America Data Center Market to Reach $6.93 Billion by 2031

Research by Arizton projects the Latin America data center construction market to reach $6.93 billion by 2031, supported by Google's $500 million investment in a new digital exchange hub in the Dominican Republic.

April 23, 2026

Skymizer Introduces HTX301 Inference Chip for Large Language Models

Skymizer has unveiled the HTX301 inference chip, capable of running 700 billion parameter models on a single PCIe card without GPU clusters. The chip is based on the HyperThought architecture and supports on-premise AI workloads with improved efficiency and scalability.

April 23, 2026

Kaishun Digital and IBM Introduce Memory Optimization Solution for HPC Enterprises

Kaishun Digital Technology has partnered with IBM to launch a memory optimization solution for high performance computing enterprises, based on IBM Spectrum LSF. The platform aims to help companies improve resource efficiency without expanding hardware investments.

April 23, 2026

ECSite Integrates Automation Platform with VIAVI Fiber Test Systems for Hyperscale Data Centers

ECSite has integrated its automation platform with VIAVI Solutions' SmartClass Fiber MPOLx test sets to streamline fiber testing in hyperscale data centers, reducing errors and improving efficiency.

April 23, 2026

SK hynix Posts Record 1Q26 Profit on Strong AI Memory Demand

SK hynix reported record quarterly revenue of 52.6 trillion won and operating profit of 37.6 trillion won in the first quarter of 2026, driven by strong demand for AI-related memory products.

April 23, 2026

NEO Semiconductor Demonstrates 3D X-DRAM Proof of Concept and Gains Strategic Investment

NEO Semiconductor has announced successful proof-of-concept results for its 3D X-DRAM technology and secured a strategic investment led by Acer founder Stan Shih to advance AI memory development.

April 23, 2026

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