SEMI and Global Net Corp Release Report on Glass Core Substrate Market Growth

SEMI and Global Net Corp. announced in a press release a new research report on the glass core substrate market and development trends for semiconductors. The report examines the potential of glass core substrates as an emerging packaging technology for advanced semiconductor applications.

According to the report, glass core substrates could support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional materials. The study outlines market scenarios suggesting initial production could begin around 2028, with adoption expanding across complex package architectures in later years.

Based on combined market scenarios, the report projects a compound annual growth rate of 67.2% for glass core substrates from 2028 through 2040. It identifies active development efforts across Asia, North America, and Europe, involving companies and research organizations working on substrate materials, processing equipment, and supply chain integration.

The report provides forecasts through 2040 and covers topics including technology drivers, commercialization barriers, and expected applications in AI, high performance computing, advanced processors, co packaged optics, and image sensors.