Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Firebird has opened an NVIDIA DSX AI factory in Armenia and outlined plans to deploy more than 70,000 NVIDIA GPUs across Armenia, Kazakhstan, and other markets by the end of 2028.
Chemours launched Opteon ZE and Opteon 515B for stationary chillers used in AI data centers, commercial buildings, and other large cooling environments.
SK hynix will invest about 54 trillion won in new fabs in Yongin and Cheongju to expand DRAM, HBM, and NAND production for AI memory demand.
Energy Concepts introduced Plato5X, a modular platform for AI data centers that generates power, cooling, water, and captured carbon on site. Each 5 MW module is designed to produce electricity, water, and food grade liquid carbon dioxide without utility power or municipal water.
Absa Bank says SAS Viya on AWS reduced credit risk reporting cycles by 80% to 90%, moving model monitoring reports from weeks to hours.
Nautilus Data Technologies says its EcoCore Facility Cooling Distribution Unit has been validated for NVIDIA AI factory infrastructure and listed on NVIDIA's DSX Infrastructure Marketplace.
Envision Energy has commissioned the Galaxy Campus in Ulanqab, Inner Mongolia, with plans to scale the AI infrastructure site beyond 2GW of capacity.
NEO Semiconductor launched NEO.AI, a memory platform combining X-SRAM and 3D X-DRAM to address AI cache and HBM capacity limits.
Sharon AI signed a five year cloud computing service agreement with a global AI platform valued at $373 million, with revenue expected to start in the first quarter of 2027.
ai& and Voltaiq plan to deploy battery energy storage systems across ai& AI data centers in Japan, using Voltaiq software to track battery quality, safety, and performance.
SK hynix and Sandisk have unveiled the first standard specifications for High Bandwidth Flash, a NAND based memory layer intended to sit between HBM and SSDs for AI systems.
Montage Technology has started trial production of its CXL 3.2 Memory eXpander Controller chip for AI, cloud, and data center memory expansion.
AZIO AI has signed a Master Services Agreement with AT&T to provide enterprise fiber connectivity for its first 500 megawatt AI data campus in Texas.
Cerberus Capital Management and Yondr Group have acquired a 40 acre site in Manassas, Virginia, for a planned 72 MW data center campus expected to start operations in 2029.
Teradata has made its Data Analyst Agent available in AWS Marketplace, allowing AWS customers to deploy conversational analytics in existing cloud environments.
Emerson Electric has introduced its DeltaV Automation Platform for Data Centers to manage power, cooling, and other critical infrastructure for AI scale facilities.
PJM Interconnection said 715 proposed generation projects totaling more than 200 GW have qualified for study under its reformed interconnection process.
Mousterian Corporation and Samsung Heavy Industries signed an engineering contract for their first moored floating data center deployment in the United States. The planned units will each provide 50 megawatts of critical IT capacity for AI compute.
Leidos and CoreWeave are collaborating on secure sovereign AI cloud services for the U.S. Intelligence Community and Department of War. CoreWeave will provide its AI cloud platform, while Leidos will handle mission integration and secure architecture.
SiEngine Technology secured US$200 million in equity financing in H1 2026 to support research, production expansion, globalization, and customer growth for its automotive chip business.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
