DB HiTek Advances 650V GaN HEMT Process for AI Data Centers
DB HiTek is finalizing its 650V GaN HEMT process, enhancing power efficiency for AI data centers and other applications, as announced in a press release.
Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
DB HiTek is finalizing its 650V GaN HEMT process, enhancing power efficiency for AI data centers and other applications, as announced in a press release.
OpenAI is exploring the possibility of establishing a data center in South Korea, as announced during the launch of its new office in the country.
Kove has announced benchmark results showing that its software-defined memory solution can handle AI inference workloads up to five times larger than local DRAM, with reduced latency.
Lam Research has introduced VECTOR TEOS 3D, a new deposition tool designed to tackle challenges in advanced chip packaging for AI and high-performance computing applications.
CIQ has announced a collaboration with NVIDIA to integrate the NVIDIA CUDA Toolkit into its Rocky Linux platform, aiming to streamline GPU acceleration for AI and HPC workloads.
Boyd has announced the delivery of five million liquid cold plates to hyperscalers, enhancing AI data center cooling technology, according to BusinessWire.
OpenAI is in preliminary discussions with Indian data center firms and Reliance Industries to bring its $500 billion Stargate AI infrastructure project to India.
OpenAI has signed a historic $300 billion cloud computing deal with Oracle, marking one of the largest contracts in the industry, according to the Wall Street Journal.
FrontierGen has released a white paper evaluating Texas' major shale basins for AI data center development, highlighting the Permian, Eagle Ford, and Haynesville regions.
Semtech Corporation has announced new FiberEdge transimpedance amplifiers (TIAs) designed to enhance power efficiency in AI data centers, according to a press release. The GN1834D and GN1818 models aim to support the growing demand for 1.6T optical interconnects.
Microsoft has entered a $17.4 billion agreement with Nebius to lease GPU infrastructure for AI operations over five years, with potential expansion to $19.4 billion.
HydraVault has announced plans to construct Chicago's first purpose-built AI data center, set to begin in Fall 2025. The facility will feature advanced cooling systems and high power density to support AI, ML, and financial trading.
Compal and ZutaCore have introduced a waterless, two-phase liquid cooling solution for AI data centers, showcased at Yotta 2025.
EcoDataCenter has obtained $703 million in debt financing from Deutsche Bank to expand its AI data centers in Sweden, focusing on sites in Falun and Borlänge.
Cisco has announced the Cisco Data Fabric, a new architecture designed to transform machine data into AI-ready intelligence, leveraging the Splunk platform to reduce costs and complexity.
PIER Group has launched Delta AI, a high-performance AI system powered by NVIDIA GH200 Grace Hopper Superchips, to support R1 and R2 universities in the U.S., announced in a press release.
Nokia and Supermicro have announced a partnership to integrate 800G Ethernet switches with Nokia's Service Router Linux, aiming to enhance AI data center networks.
NVIDIA has announced the Rubin CPX GPU, designed for handling large context windows in AI applications, expected to be available by the end of 2026.
The semiconductor market for robots is projected to grow significantly, reaching $41.24 billion by 2030, according to a report by MarketsandMarkets. This growth is driven by new applications in sectors like healthcare and logistics.
D-Matrix has announced its new JetStream I/O accelerators, designed to deliver ultra-low latency for AI inference at scale, according to a press release. The JetStream, paired with Corsair accelerators and Aviator software, promises significant improvements in speed, cost-performance, and energy efficiency.