Airsys Introduces PowerOne Cooling Platform for AI Data Centers

November 24, 2025
Airsys Cooling Technologies Inc. has announced PowerOne, a modular cooling architecture built to handle high-density AI and HPC data center environments, supporting deployments from 1MW to over 100MW.

Airsys Cooling Technologies Inc. has launched PowerOne, an intelligent and scalable cooling platform for modern data centers, announced in a press release. The system is designed to address the increasing power density and energy efficiency challenges driven by AI, high-performance computing, and big data workloads.

PowerOne features a modular, multi-medium architecture capable of scaling from 1MW edge deployments to more than 100MW hyperscale facilities. It includes two primary configurations: the Standard Cooling Stack, which integrates components such as CritiCool-X chillers, FluidCool-X CDUs, MaxAir fan walls, and Optima2 CRAH units; and the LiquidRack solution, a closed-loop liquid cooling system optimized for AI-era deployments.

The platform achieves zero Water Usage Effectiveness (WUE) and industry-leading Power Usage Effectiveness (PUE), while introducing Power Compute Effectiveness (PCE) as a new metric to measure how efficiently power is converted into computing performance. This combination aims to maximize compute density and reduce operational overhead.

Airsys also introduced Aegis, a new liquid cooling division focused on developing two-phase cooling components such as cold plates and control systems that expand the PowerOne ecosystem. PowerOne products are available for pre-order now, with initial availability expected in the fourth quarter of 2025.

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