Supermicro Expands Liquid-Cooled AI Infrastructure for NVIDIA Vera Rubin Platforms

January 06, 2026
Supermicro has announced expanded production and liquid-cooling capabilities to support NVIDIA's upcoming Vera Rubin and Rubin platforms, aiming to accelerate delivery of next-generation AI data center solutions.

Supermicro has announced expanded production and liquid-cooling capabilities to support upcoming NVIDIA Vera Rubin and Rubin platforms, according to a press release. The company said it aims to deliver optimized, data center–scale solutions for NVIDIA’s flagship Vera Rubin NVL72 and HGX Rubin NVL8 systems.

Supermicro’s Data Center Building Block Solutions (DCBBS) and direct liquid cooling (DLC) technology, designed and manufactured in the United States, will be used to accelerate deployment of these next-generation AI infrastructures. The company said its approach allows for streamlined production, extensive customization, and faster rollout timelines.

The collaboration with NVIDIA positions Supermicro to be among the first to bring liquid-cooled, rack-scale AI systems to market, targeting higher performance and efficiency for advanced computing environments.

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