Wiwynn and Partners to Showcase Co-Packaged Optics at Computex 2026

Wiwynn announced in a press release that it will present its latest co-packaged optics interconnect technologies at Computex 2026 in Taipei. The demonstration will take place at the Nangang Exhibition Center and will involve ecosystem partners including Ayar Labs, Global Unichip Corp. (GUC), Browave, Corning, FOCI, Molex, SENKO, and TE Connectivity.

The companies will exhibit a complete optical connectivity path from chip-level innovation to data center-scale deployment. Wiwynn stated that co-packaged optics can reduce signal loss and power consumption by integrating optical I/O directly with AI ASICs, supporting the growing performance and bandwidth requirements of large-scale AI infrastructure.

Wiwynn and Ayar Labs are working together to integrate Ayar Labs’ TeraPHY optical engines and SuperNova light sources into Wiwynn’s rack architecture. This collaboration aims to deliver high-bandwidth, power-efficient connectivity while addressing challenges such as fiber management, thermal control, and manufacturability for hyperscaler deployment.

Wiwynn has also developed an in-house liquid cooling solution to stabilize external light sources used in co-packaged optics systems. In addition, its partnership with GUC focuses on incorporating system-level requirements during the chip design phase to simplify integration and speed up development.

Other partners, including Browave, Corning, FOCI, Molex, SENKO, and TE Connectivity, will showcase fiber routing and optical interconnect components that complete the optical path from server chassis to rack systems. Wiwynn plans to continue expanding its collaborations to move co-packaged optics from demonstration to large-scale deployment in AI data centers.