Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Plug and Play has announced a collaboration with Synopsys to provide startups with access to advanced semiconductor design tools, aiming to lower barriers to chip innovation.
ROHM Semiconductor has introduced AI-equipped microcontrollers capable of predicting equipment anomalies without network reliance, announced in a press release.
Mindbeam AI has announced the availability of its Litespark framework on AWS Marketplace, significantly reducing large language model training times with NVIDIA technology.
Vast.AI has announced its expansion to San Francisco with a new office in the SOMA district, aiming to leverage the area's AI talent pool for new product initiatives.
US Signal has announced a $200 million investment to expand its data centers in Detroit Metro and Des Moines, and deploy over 1,000 miles of new fiber, according to a press release.
CoreWeave has appointed Ernie Rogers as Chief Architect of Strategic Financing to drive its next phase of growth, announced in a press release. Rogers brings extensive financial strategy experience from his previous role as COO at Magnetar.
CloudZero has signed a Strategic Collaboration Agreement with AWS to enhance cloud efficiency using AI technologies, announced in a press release.
CoreWeave, in collaboration with NVIDIA and IBM, has submitted the largest-ever MLPerf Training v5.0 results using NVIDIA GB200 Grace Blackwell Superchips, achieving breakthrough performance on complex AI models.
Xanadu has achieved a milestone by generating error-resistant photonic qubits on an integrated chip platform, as announced in a press release. This breakthrough is a key step in developing scalable quantum hardware.
New Era Helium, Inc. and Sharon AI, Inc. have entered a Memorandum of Understanding with PowerForward Energy Solutions to provide 250MW of power for their AI data center in Ector County, Texas, according to BusinessWire.
Hudson Interxchange will deploy DDC Solutions' S-Series cooling platform at its 60 Hudson Street data center in New York, with Cato Digital as the first customer.
Ecolab has launched 3D TRASAR Technology for Direct-to-Chip Liquid Cooling, a new solution to enhance data center performance by monitoring coolant health indicators in real time.
Mixed-Signal Devices has launched a new portfolio of multi-gigahertz timing solutions, offering sub-20 fs jitter and 2 GHz performance, designed for AI, 5G, and aerospace systems.
Microsoft is set to invest $400 million in Switzerland to enhance its AI and cloud infrastructure, according to Reuters. The investment will expand data centers near Zurich and Geneva to meet growing demand.
GridFree AI has introduced its Power Foundry™ platform, enabling rapid data center deployment with grid-independent power solutions, announced in a press release.
Applied Digital has signed two 15-year lease agreements with CoreWeave for a 250MW AI data center in North Dakota, expected to generate $7 billion in revenue.
WhiteFiber, a subsidiary of Bit Digital, has acquired a 96-acre property in North Carolina to develop a high-performance computing data center campus.
AI Pulse has launched GDePIN, a decentralized GPU compute model that allows users to earn by contributing idle computing power, announced in a press release.
TECfusions and Baeza Group have secured a land deal to develop Chile's largest planned data center in Puente Alto, with an initial capacity of 10 MW, scalable to 100 MW.
Kearney's latest report reveals AI's significant demand on semiconductor supply, with trade barriers reinforcing global divisions and declining buyer confidence.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
