Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
SoftBank Corp. announced its Telco AI Cloud vision, integrating GPU cloud, AI-RAN, and a new software stack to build distributed AI infrastructure leveraging its telecommunications network.
Supermicro announced expanded support for AI-RAN and Sovereign AI infrastructure at MWC Barcelona, showcasing systems powered by NVIDIA technologies and collaborations with Nokia, SK Telecom, and Telenor.
Dutch AI chipmaker Axelera AI has raised $250 million to scale manufacturing and commercialization of its energy-efficient inference chips designed for edge computing, according to Sifted.
SWI Stoneweg Icona Group has agreed to acquire a majority stake in Polarise, a German NVIDIA Cloud Partner, to expand its AI infrastructure capabilities. The deal includes a €1 billion investment to develop GPU- and AI-as-a-Service offerings across Europe.
OpenAI has partnered with India's Tata Group to secure 100 megawatts of AI-ready data center capacity, with plans to scale to 1 gigawatt as part of its Stargate infrastructure initiative.
Lattice Semiconductor reported $523.3 million in revenue for the full year 2025 with strong growth in communications and computing. The company expects up to 37% year-over-year revenue growth in the first quarter of 2026.
Dell'Oro Group projects a 25% compound annual growth rate for the global data center accelerator market over the next five years, citing increasing adoption of AI workloads and custom accelerators by hyperscale cloud providers.
Energy Vault and Peak Energy have announced a strategic partnership to co-develop a sodium-ion energy storage platform for AI-first data center operators, including a 1.5 GWh supply agreement for U.S.-manufactured batteries.
Sunrise New Energy Co., Ltd. has rebranded to E-Power Inc. to align with its shift toward artificial intelligence data center microgrid solutions, effective February 12, 2026.
Microsoft is exploring high-temperature superconductors to improve energy efficiency and power capacity in its data centers, reducing transmission losses and physical infrastructure needs.
Zettabyte and LITEON Technology have announced a research and development collaboration to build the Ultra Edge Pod, a distributed edge AI inferencing platform designed for deployment at cell tower and network-proximate locations.
OpenAI has introduced GPT-5.3-Codex-Spark, a lightweight version of its Codex coding model powered by Cerebras’ Wafer Scale Engine 3 chip. The model focuses on fast inference for real-time coding and is available in research preview for ChatGPT Pro users.
EPRI has announced a collaboration with Nvidia, Prologis, and InfraPartners to create smaller, distributed data centers designed for AI inference workloads. The initiative will test micro data centers near utility substations to improve efficiency and grid reliability.
Cisco has announced the Silicon One G300 chip, along with new N9000 and 8000 systems, optics, and management tools aimed at improving AI data center efficiency and scalability.
US Signal is constructing over 1,000 miles of new high-density fiber and conduit infrastructure across Ohio and Indiana, connecting core and edge data centers to support AI and cloud workloads. About 30 percent of the network is complete, with full completion expected by early 2027.
DG Matrix and Exowatt have announced a strategic partnership to integrate solid-state transformer technology into Exowatt’s renewable energy systems, enabling gigawatt-scale, dispatchable power for AI data centers.
Abu Dhabi’s G42 and US-based Cerebras Systems have introduced a wafer-scale AI chip containing four trillion transistors, presented at the World Governments Summit in Dubai. The chip will be deployed at G42’s upcoming 5-gigawatt AI campus in Abu Dhabi, described as the largest AI factory outside the United States.
SuperX Industries Co., Ltd. has signed a Memorandum of Understanding with Digital Dynamic Inc., eole Inc., and Woodman Inc. to co-develop modular AI data centers across Japan, starting with a pilot project in Mie Prefecture.
Texas Instruments announced it will acquire Silicon Labs in an all-cash deal valued at approximately $7.5 billion, with the transaction expected to close in the first half of 2027 pending regulatory approval.
Semidynamics has introduced its 3nm AI inference silicon and a vertically integrated stack covering chips, boards, and rack-scale systems for next-generation data centers.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
