Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
CollPlant plans to use proceeds from a $3.7 million private placement to support LightSolver's laser based computing architecture and Laser Processing Unit technology.
Acbel will present power shelves for 800V, ±400V and 50V DC architectures at the OCP Global Summit 2026.
Viega's ProPress Stainless and MegaPress Stainless piping products have received OCP Accepted status and joined the Open Compute Project Marketplace.
DC Market Insights forecasts the global AI chip market will grow from $185.26 billion in 2025 to $677.59 billion by 2035, as inference and custom silicon account for more spending.
LiquidJet Diamond uses an integrated diamond spreader to cool GPU hotspots. Frore Systems says it can deliver 30% to 35% more AI tokens per watt than a traditional skived coldplate.
Old World Industries and Integrity Systems are combining heat transfer fluids with continuous monitoring and predictive diagnostics for AI data center cooling systems.
Delta Electronics will present power, microgrid and liquid cooling systems for AI data centers at the OCP Global Summit 2026 in San Jose.
Architect Digital has launched a free platform that lets US residents find proposed AI data centers, register their views and organize locally.
Scality AI Inference Factory combines open weight models, inference serving, workload controls and shared storage for running AI on infrastructure owned by customers.
Xsight Labs introduces the E1L, a programmable data processing unit that supports up to 200 Gbps networking with configurable power from 25 to 40 watts.
The compact workstation runs large AI models locally using an AMD Ryzen AI Max+ PRO 495 processor and up to 192GB of unified memory.
Green Badger introduced free AI tools that prepare site and water assessments for LEED projects. The company also combined its sustainable construction products in one platform.
A DIGITIMES Intelligence report examines the shift toward 800 VDC power distribution as AI racks require more electricity. It also assesses the roles of gallium nitride and silicon carbide components.
Airoha will demonstrate a gateway processor that supports 50 Gbps transmission in each direction, Wi-Fi 8 and local AI tools for network diagnostics.
North Dakota has 17 data centers in development, compared with 15 operating facilities, as low electricity prices and available grid capacity attract AI computing projects.
Microelectronics US named a 19 member steering committee for its inaugural conference in Austin, scheduled for May 4 to 5, 2027.
NX Group and Japan Airlines have started a weekly Boeing 747 freighter service connecting Los Angeles with major Asian cargo hubs. The route targets demand for servers, semiconductor equipment and other heavy cargo.
E&R Engineering will present laser processing equipment for co packaged optics and advanced chip packaging at SEMI West 2026. Its five axis system drills fiber array units with accuracy of ±0.5 μm.
L-Nex combines server management, telemetry, remote access, and security in a reconfigurable FPGA SoC running OpenBMC.
Hanwha's EnergyFluo system was selected for Fast Company's 2026 Next Big Things in Tech list. The software uses agentic AI to manage power generation, storage, cooling and IT loads at data centers.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.