Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
55H has announced a phased expansion of its data center capacity in Brampton, Ontario, to meet the increasing demands of AI clients, providing up to 20 MW of IT power by 2026.
Neuchips has partnered with Vecow and GSH to enhance SQL data processing using offline generative AI, providing secure and efficient solutions for enterprises.
CIM Group and Novva Data Centers have secured $2 billion in financing to complete their Salt Lake City data center campus, one of the largest AI data centers globally.
Caspia Technologies has revealed that its CODAx AI-assisted security linter identified 16 security vulnerabilities in a popular OpenRISC CPU core, significantly outperforming existing industry tools.
Huawei has introduced its next-generation site power facility architecture, 'Single SitePower,' and AI data center construction guideline, RASTM, at MWC Barcelona 2025.
EcoDataCenter, a Swedish provider of eco-friendly colocation data centers, has raised $478 million to expand its green infrastructure, focusing on sustainable technology and partnerships with major AI companies.
SK Telecom has announced a strategic partnership with Schneider Electric to enhance AI data center capabilities, focusing on mechanical, electrical, and plumbing systems.
CoreWeave has announced its agreement to acquire Weights & Biases, aiming to create an end-to-end platform for AI labs and enterprises, according to a press release.
Penguin Solutions has expanded its ICE ClusterWare software platform with new features and launched the ICE ClusterWare AIM service to enhance AI infrastructure management, according to Business Wire.
Huawei has launched new AI-ready data storage solutions to support carriers in their AI transformation, announced in a press release.
Fluidstack, in partnership with Eclairion, will deliver Europe's largest AI supercomputer to Mistral AI by 2025, utilizing decarbonized energy in France.
VVDN Technologies has announced the launch of its AI-powered Wi-Fi 7 Access Point Reference Designs, developed in collaboration with Qualcomm Technologies, at MWC Barcelona 2025.
Telit Cinterion has launched the FE990D and FN990D, AI-powered 5G modules and data cards featuring Qualcomm's X85/82 5G Modem-RF, enhancing connectivity and performance.
Advanced Brain Methodologies Inc. (ABM) has announced the launch of the world's first Emotion Processing Unit (EPU) chip, a groundbreaking neuro-chip designed to revolutionize mental health and cognitive performance.
yieldWerx has announced a strategic partnership with Incusolution to enhance the South Korean semiconductor industry by providing localized yield management solutions.
Lenovo has introduced the ThinkEdge SE100, a compact AI inferencing server designed to bring enterprise-level AI capabilities to the edge, announced in a press release. The server is 85% smaller than traditional models, offering GPU-ready performance for diverse environments.
SoftBank, ZutaCore, and Foxconn have collaborated to implement ZutaCore's two-phase DLC technology in AI servers using NVIDIA GPUs, achieving high cooling efficiency.
Supermicro has announced plans for a third campus in Silicon Valley, expanding its manufacturing capacity to nearly 3 million square feet, according to a press release.
Hyperscale Data's subsidiary, Alliance Cloud Services, has reached an agreement to add 40 megawatts to its Michigan data center, increasing its capacity to 340 megawatts.
RADCOM Ltd. is developing a next-gen data plane analytics solution using NVIDIA BlueField-3 DPU, targeting a commercial launch in early 2026.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
