E&R Engineering to Show CPO Laser Tools at SEMI West 2026

Oct 6, 2026
E&R Engineering will present laser processing equipment for co packaged optics and advanced chip packaging at SEMI West 2026. Its five axis system drills fiber array units with accuracy of ±0.5 μm.

E&R Engineering will present precision laser processing equipment for co packaged optics and advanced chip packaging at SEMI West 2026, the company said in an announcement.

The company’s five axis laser system drills fiber array units with accuracy of ±0.5 μm. It supports two dimensional FAU configurations for bandwidths of 3.2 Tbps, 6.4 Tbps and 12.8 Tbps, along with multiple hole shapes and machining angles.

E&R Engineering will also show equipment for 2.5D and 3D integrated circuit packaging and high density substrates. The equipment supports laser drilling with accuracy of ±5 μm, multibeam laser marking with accuracy of ±25 μm, thermal control laser cutting, ABF grooving, laser debonding and plasma based surface cleaning and activation.

SEMI West 2026 will run from October 13 to 15 at Moscone Center in San Francisco. E&R Engineering will exhibit at booth 2153 in South Hall C.

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