Longsys to Unveil Industrial mSSD at electronica 2026
Longsys will unveil its first industrial mSSD with wide temperature support at electronica 2026 in Munich, the company announced in a press release. The event runs from 10 to 13 November.
The mSSD uses system in package technology to combine its controller, flash memory and passive components in one package. The design removes the need for surface mount assembly and associated solder joints. It also provides protection against water, dust and shock.
Longsys will display UFS, eMMC, LPDDR and SPI NAND Flash products for automotive and industrial uses. Live demonstrations will feature AISSD, AIDIMM and HLCache UFS technologies for data access, model loading and cache acceleration on edge AI devices.
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