TU/e, TUM Venture Labs and boOst start European Future Chips Launchpad

Nov 12, 2026
Three European tech transfer groups signed an MoU at SEMICON Europa 2026 to help semiconductor, photonics and quantum startups find industrial partners.

Eindhoven University of Technology (TU/e), TUM Venture Labs and Startup Factory boOst signed a memorandum of understanding at SEMICON Europa 2026 in Munich to launch the European Future Chips Launchpad (EFCL), TU/e announced.

The initiative is meant to help create semiconductor, photonics and quantum technology startups. The partners say it will not be another research programme or funding instrument. It will connect new ventures with industrial partners and launching customers, because seed funding alone is not enough.

TUM Venture Labs is a joint initiative of the Technical University of Munich and UnternehmerTUM. Startup Factory boOst is a non-profit in Dresden with TU Dresden among its shareholders. The partners plan to grow EFCL into a pan-European venture engine for these technologies from 2027, alongside existing programmes such as Chips JU and the European Innovation Council.

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