Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
BTC Digital Ltd. has completed construction of its 10 megawatt computing infrastructure in Georgia and announced its transformation into an AI computing platform, with plans to expand capacity up to 25 megawatts.
IDrive e2 has launched a new storage region in Tokyo, marking its first in Japan and expanding its global network to enhance performance and accessibility for AI and data-intensive applications.
Oracle and BorderPlex Digital Assets will use Bloom Energy fuel cells to power Project Jupiter, a large AI data center campus in New Mexico, replacing gas turbines and diesel generators with a low-emission microgrid.
Marvell Technology has acquired Swiss silicon photonics startup Polariton Technologies to strengthen its optical interconnect capabilities and advance performance scaling to 3.2T and beyond. Financial details of the transaction were not disclosed.
BT and Nscale announced plans to build sovereign AI data centres across the UK powered by NVIDIA infrastructure, expanding the country's AI compute capacity and supporting government goals for digital sovereignty.
Munters has received a 2 billion SEK order from a US colocation data center provider for a modular cooling platform designed for AI infrastructure. Deliveries will begin in early 2027 and continue through the first quarter of 2028.
Arasan Chip Systems has announced the immediate availability of its UFS 5.0 host controller IP, supporting data rates up to 46.694 Gbps and designed for advanced mobile and AI edge applications.
M31 Technology has completed the tapeout of its eUSB2V2 interface IP on TSMC's N2P 2 nm process, marking a milestone in advanced node interface development focused on high-speed, low-power connectivity for AI, HPC, and mobile applications.
Research by Arizton projects the Latin America data center construction market to reach $6.93 billion by 2031, supported by Google's $500 million investment in a new digital exchange hub in the Dominican Republic.
Skymizer has unveiled the HTX301 inference chip, capable of running 700 billion parameter models on a single PCIe card without GPU clusters. The chip is based on the HyperThought architecture and supports on-premise AI workloads with improved efficiency and scalability.
Kaishun Digital Technology has partnered with IBM to launch a memory optimization solution for high performance computing enterprises, based on IBM Spectrum LSF. The platform aims to help companies improve resource efficiency without expanding hardware investments.
ECSite has integrated its automation platform with VIAVI Solutions' SmartClass Fiber MPOLx test sets to streamline fiber testing in hyperscale data centers, reducing errors and improving efficiency.
SK hynix reported record quarterly revenue of 52.6 trillion won and operating profit of 37.6 trillion won in the first quarter of 2026, driven by strong demand for AI-related memory products.
NEO Semiconductor has announced successful proof-of-concept results for its 3D X-DRAM technology and secured a strategic investment led by Acer founder Stan Shih to advance AI memory development.
Lam Research reported revenue of $5.84 billion for the quarter ended March 29, 2026, with a GAAP diluted EPS of $1.45 and operating margin of 35 percent.
Neurophos has nearly tripled in headcount since its $110 million Series A funding, adding senior hires from major tech firms and opening new facilities in Austin and Redwood City.
AMI has validated its Aptio V UEFI/BIOS and MegaRAC OneTree BMC firmware for Arm AGI CPU platforms, becoming the first firmware vendor integrated with Arm’s AGI CPU reference board.
Natixis Corporate & Investment Banking has arranged a $2.6 billion syndicated letter of credit facility for Switch to support power infrastructure for its data centers across major U.S. markets.
Hyperscale Data is reconfiguring its Michigan facility into a combined AI data center and robotics hub through a partnership with AGIBOT, dedicating over 100,000 square feet for robotics assembly, testing, and AI model training.
SiMa.ai has received the 2026 Product of the Year Award from the Edge AI and Vision Alliance for its Modalix MLSoC System on Module, recognized as the Best Edge AI Board for delivering high performance and efficiency in power-constrained environments.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
