SUNON to Show Liquid Cooling Systems for AI Computing at OCP Summit

Sep 29, 2026
SUNON will present liquid cooling technologies for AI computing at the 2026 OCP Global Summit in San Jose. The portfolio covers chip, server, and rack cooling applications.

SUNON will showcase liquid cooling technologies for high performance AI computing at the 2026 OCP Global Summit, the company said in a press release. The systems address rising chip power densities and thermal loads.

The portfolio covers chip, server, and rack applications. SUNON says the systems support different power densities, operating environments, and deployment requirements.

The Open Compute Project Foundation will hold the summit from October 12 to 15, 2026, at the San Jose McEnery Convention Center in California. SUNON will exhibit at Booth A19.

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