SUNON to Show Liquid Cooling Systems for AI Computing at OCP Summit
Sep 29, 2026
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Compal to Show NVIDIA AI Factory Infrastructure at OCP Summit
Sep 29, 2026
Compal Electronics will present AI data center infrastructure that combines power, liquid cooling, accelerated computing and rack scale engineering at OCP Global Summit 2026.
Compal Electronics will present infrastructure for NVIDIA based AI factories at OCP Global Summit 2026 in San Jose, California, the company said in a press release. The systems combine power, liquid cooling, accelerated computing and rack scale engineering.
Compal will show 800 volt direct current power architectures and megawatt scale energy infrastructure for AI data centers. It will also demonstrate liquid cooling technology designed for megawatt scale deployments.
The company will present the components as an integrated system spanning the electrical grid, racks and GPUs. The demonstration will be available at booth E65 during the summit organized by the Open Compute Project Foundation.
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