Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
At the 2026 BloombergNEF Summit, Schneider Electric presented research showing that artificial intelligence could drive up to half of U.S. electricity demand growth by 2030 and outlined strategies for accelerating grid modernization and electrification.
Denham Capital has formed a strategic partnership with First American Nuclear to deliver integrated power solutions for AI and hyperscale data centers, combining nuclear and on-site generation capabilities.
EQT has introduced an AI Infrastructure strategy aimed at expanding global data and energy infrastructure to meet rising AI demands. The initiative is seeded by EdgeConneX and will focus on developing large-scale data centers across major markets worldwide.
More than half of planned US data center projects are being delayed due to shortages of key electrical components, while several states have moved to suspend or regulate new construction amid rising electricity and water consumption concerns.
Treon has launched its Make Cloud solution, a fully managed AI maintenance service hosted on AWS Cloud, with TotalEnergies Marketing Italia as an early adopter in the cement and ceramics sectors.
Six NHS Trusts in north central London have signed a GBP 15.6 million contract with Sectra to consolidate their imaging systems into a single cloud environment using Sectra One Cloud, improving cybersecurity and collaboration across hospitals.
NVIDIA CEO Jensen Huang will present the company's latest AI innovations at COMPUTEX 2026 in Taipei on June 1, ahead of GTC Taipei, which runs June 2 to 4.
RoboSense introduced its EOCENE SPAD SoC architecture along with two new chipsets, Phoenix and Peacock, at its 2026 Tech Day in Shenzhen. The Phoenix chipset is an automotive-grade monolithic SPAD SoC with 2,160-beam image-grade output, while the Peacock chipset is a fully solid-state SPAD SoC designed for robotics. The company also previewed its RGBD sensor, planned for release by 2027.
Sana Ouji, a longtime Google energy and data center executive, has joined Anthropic to help build its new energy team focused on scaling global data center operations.
SK hynix has begun mass production of its 192GB SOCAMM2 memory module, designed for NVIDIA’s Vera Rubin platform. The module uses 1cnm process LPDDR5X DRAM and delivers over twice the bandwidth and 75% better power efficiency than conventional RDIMM modules.
Google is negotiating with Marvell Technology to design two new chips for AI inference, including a memory processing unit to complement its tensor processing units and a new TPU built for running AI models more efficiently, according to The Information.
Delta Electronics has introduced a unified power, cooling, and infrastructure architecture for AI data centers, presented at Data Center World 2026 in Washington. The platform integrates power systems, liquid cooling, and intelligent controls to support high-density AI workloads efficiently.
Atlas Data Storage has been chosen by TSMC to present its CMOS-enabled molecular data storage technology at the 2026 TSMC Technology Symposium, highlighting its advancements in high-density and durable data preservation solutions.
Steele Solutions, backed by Revelar Capital, has acquired Maysteel Industries to expand its presence in data center and electrical infrastructure markets. The deal strengthens Steele Solutions’ position as a North American provider of engineered products for material handling and data center applications.
Mountain Vector Energy has launched Cufflink Nova, a secure AI platform designed to help organizations reduce utility costs and manage energy and water resources more efficiently. The system processes facility data to deliver insights, forecasts, and reports across large portfolios.
Mitate Zepto Technica has joined the Japan Science and Technology Agency’s Next-Generation Edge AI Semiconductor R&D Program as a social implementation partner, focusing on genome analysis acceleration through its RASEN ASIC platform.
InPHRED has announced its entry into the data center optical interconnect market with new InP VCSEL and micro-RC-LED technologies aimed at AI infrastructure. The company plans to demonstrate both technologies in early 2027.
TD SYNNEX has expanded its AI Infrastructure-as-a-Service portfolio with dedicated NVIDIA HGX B300 clusters on Nebius AI Cloud, offering partners reserved GPU capacity to support enterprise-scale AI workloads.
OpenAI has agreed to spend more than $20 billion over three years on Cerebras servers powered by the company’s chips, in a deal that could give OpenAI up to a 10% equity stake in the chipmaker. The agreement includes an additional $1 billion from OpenAI to help fund Cerebras data center development.
Upscale AI is reportedly negotiating a new funding round that could value the company at about $2 billion, marking its third raise in seven months. The startup is developing specialized chips and networking technology for AI data centers.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
