Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Johnson Controls has introduced a Reference Design Guide Series for 1-gigawatt AI data centers, providing detailed thermal architectures for water-cooled, air-cooled, and absorption chiller systems integrated with advanced building controls.
SpaceX has acquired Elon Musk’s artificial intelligence company xAI, merging the two firms to develop orbital data centers powered by solar energy and launched via Starship.
Oracle announced plans to raise between $45 and $50 billion in 2026 through a mix of debt and equity financing to expand its Oracle Cloud Infrastructure capacity for major clients including AMD, Meta, NVIDIA, OpenAI, TikTok, and xAI.
FPT Corporation has announced the creation of the FPT Advanced Semiconductor Testing and Packaging Plant in Bac Ninh Province, marking Vietnam’s first fully Vietnamese-owned facility of its kind. The plant will enhance the country’s semiconductor ecosystem and provide training for local engineers.
ASML reported a record €13 billion in new orders for the fourth quarter of 2025, signaling continued strong demand for advanced chipmaking equipment driven by artificial intelligence infrastructure growth. The company posted €32.7 billion in annual net sales and announced plans to cut 1,700 jobs.
Blaize and Nokia have signed a Memorandum of Understanding to collaborate on edge and hybrid AI inference solutions across Asia-Pacific, combining Blaize's AI platform with Nokia's networking and automation systems.
Lucend, formerly known as Coolgradient, has raised $3.3 million in seed funding led by Remarkable Ventures Climate to expand its Transparent AI platform for data center optimization in the U.S.
Ricursive Intelligence has raised $300 million in a Series A funding round led by Lightspeed Venture Partners, valuing the company at $4 billion. The Palo Alto-based startup, founded by Dr. Anna Goldie and Dr. Azalia Mirhoseini, aims to accelerate semiconductor design using AI.
SK hynix announced plans to establish a U.S.-based AI solutions firm, tentatively named AI Company (AI Co.), through the restructuring of its Solidigm subsidiary, with a $10 billion capital commitment to strengthen its role in the AI data center ecosystem.
BOSGAME has introduced two AI PC models, the VTA-439 and VTI-490, built on AMD Ryzen and Intel Core Ultra platforms, with global availability set for early 2026.
Saitech has configured and deployed a million-dollar Supermicro liquid-cooled computing system for the U.S. Army, providing rugged, high-density performance for mission-critical operations.
NVIDIA has invested $2 billion in CoreWeave to accelerate the AI infrastructure company's plans to build over 5 gigawatts of data center capacity by 2030. The deal nearly doubles NVIDIA's stake and strengthens their collaboration on AI computing infrastructure.
Microsoft has launched the Maia 200, an AI inference accelerator built on TSMC’s 3-nanometer process, designed to improve performance and efficiency for large-scale AI workloads. The chip delivers up to 10 petaflops in 4-bit precision and powers models including GPT-5.2 and Microsoft Copilot.
Samsung Electronics is set to start mass production of its next-generation HBM4 memory chips next month, with shipments expected to go to Nvidia after completing final qualification stages.
Intel expects first-quarter revenue and profit to fall below analyst estimates as it struggles to meet demand for server chips used in AI data centers, leading to a 13% drop in its share price.
Nvidia CEO Jensen Huang said the global expansion of artificial intelligence is fueling what he described as the largest infrastructure buildout in human history, projecting $85 trillion in investments over the next 15 years.
Austin-based Neurophos has raised $110 million in a Series A round led by Gates Frontier to develop its photonic AI chips, which use micron-scale metamaterial optical modulators to boost performance and energy efficiency.
Portland-based AheadComputing has raised $30 million in a Seed2 round led by Eclipse, Toyota Ventures, and Cambium to accelerate development of its RISC-V-based CPU architecture designed for AI applications.
BOS Semiconductors has licensed Ceva’s SensPro AI DSP architecture for its Eagle-A automotive SoC, designed to enhance real-time perception and sensor fusion in advanced driver assistance systems.
Jon Peddie Research has released an extensive report analyzing the rapidly expanding AI processor market, highlighting over $28.5 billion in investments and activity from 120 startups.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
