Supermicro Showcases AMD Helios Rack Scale AI Platform at Computex

June 02, 2026
Supermicro is collaborating with AMD to present the new Helios rack scale platform at Computex. The system combines AMD Instinct MI455X GPUs and 6th Gen EPYC CPUs to support large-scale AI workloads with improved efficiency and scalability.

Supermicro, in collaboration with Advanced Micro Devices, Inc. (AMD), will present the AMD Helios rack scale platform at Computex as announced in a press release. The platform is designed for large-scale AI workloads including model training, inference, and fine-tuning, and aims to provide improved scalability and operational efficiency.

The Helios system integrates AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, and AMD Pensando networking technologies within an open rack scale architecture. It is unified by the AMD ROCm software stack and supports modular scalability from single racks to clusters. The system also includes features for open networking, advanced security, and integrated virtualization.

Supermicro’s implementation of the Helios platform uses its Data Center Building Block Solutions architecture, which shifts from traditional server designs to complete rack scale systems. The 72 GPU configuration is intended to deliver high compute density and power efficiency through advanced cooling and software acceleration. The platform will be displayed at the Supermicro booth in the Taipei Nangang Exhibition Center.

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