Flex Presents Scalable Power Solutions for AI Infrastructure at COMPUTEX 2026

Jun 2, 2026
Flex introduced new power products at COMPUTEX 2026, including a 110 kW power shelf for NVIDIA platforms and a 30 kW Capacitive Energy Storage System, designed to support high-density AI data centers and future 800 VDC architectures.

Flex announced in a press release the introduction of new power solutions at COMPUTEX 2026, aimed at supporting AI infrastructure growth and increasing rack power density. The company unveiled a 110 kW power shelf for NVIDIA Vera Rubin NVL72 platforms, a 30 kW Capacitive Energy Storage System (CESS), and the BMR317 intermediate bus converter for high-density compute platforms.

The 110 kW power shelf is built for modular rack-level distribution and supports scalable AI factory architectures. It is designed to simplify rack power management while enabling future 800 VDC deployments. The 30 kW CESS improves power quality and stabilizes dynamic AI workloads, operating with both AC and 800 VDC environments. It integrates with battery energy storage systems and supports 19-inch and 21-inch rack configurations.

The BMR317 converter extends Flex’s AI power portfolio by delivering efficient power to accelerator cards, servers, and xPU platforms. All three products will be showcased at COMPUTEX 2026 from June 2 to 5 at booth J0132, as part of Flex’s Cloud and Power Infrastructure portfolio.

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