OpenAI & Broadcom's Big AI Move, Graphcore's £1B Investment, and Microsoft's New AI System - Silicon Brief #40
October 20, 2025 -
Silicon Brief
Hi there,
In this edition of Silicon Brief, we're diving into the latest developments in AI chips and data centers. OpenAI and Broadcom are teaming up to deploy AI accelerators, a move that could significantly enhance computational capabilities for AI workloads. Meanwhile, Graphcore is making a substantial investment of £1 billion to establish an AI campus in Bengaluru, aiming to bolster its presence in the AI hardware sector.
On the data center front, Microsoft has rolled out a new AI system specifically designed to handle OpenAI workloads, showcasing the growing demand for specialized infrastructure. Additionally, Flex has introduced an AI platform tailored for gigawatt-scale data centers, highlighting the industry's shift towards more efficient and scalable solutions. Stay tuned as we explore these stories and more in this edition.
In this edition of Silicon Brief, we're diving into the latest developments in AI chips and data centers. OpenAI and Broadcom are teaming up to deploy AI accelerators, a move that could significantly enhance computational capabilities for AI workloads. Meanwhile, Graphcore is making a substantial investment of £1 billion to establish an AI campus in Bengaluru, aiming to bolster its presence in the AI hardware sector.
On the data center front, Microsoft has rolled out a new AI system specifically designed to handle OpenAI workloads, showcasing the growing demand for specialized infrastructure. Additionally, Flex has introduced an AI platform tailored for gigawatt-scale data centers, highlighting the industry's shift towards more efficient and scalable solutions. Stay tuned as we explore these stories and more in this edition.
Energy & Sustainability
Bloom Energy has partnered with Brookfield for a $5 billion investment to deploy Solid Oxide Fuel Cell technology in AI data centers globally. Meanwhile, the Open Compute Project Foundation and iMasons have launched a specification to standardize carbon impact reporting in the data center industry, with support from major tech companies.
Technology
Acbel presented its Ruby-level power rack system at the OCP Global Summit 2025, designed to support hyperscale AI and HPC workloads with scalable power and high efficiency. Meanwhile, Wistron and Wiwynn revealed AI robots for autonomous liquid cooling management in data centers, aiming to reduce downtime and enhance sustainability.
Regulation & Policy
The Dutch Government has taken control of Nexperia, a Chinese-owned semiconductor company, citing national security concerns to ensure the availability of critical chips in Europe.
Data Centers
OpenAI and Broadcom have announced a partnership to deploy 10 gigawatts of AI accelerators by 2029, integrating Broadcom's networking solutions with OpenAI's hardware. Meanwhile, Graphcore, a subsidiary of SoftBank Group, plans to invest £1 billion over the next decade to establish an AI Engineering Campus in Bengaluru, India, creating 500 semiconductor jobs and enhancing India's role in AI computing.
- OpenAI and Broadcom Partner for AI Accelerator Deployment
- Graphcore to Invest £1 Billion in Bengaluru AI Campus
- Microsoft Deploys AI System for OpenAI Workloads
- Flex Unveils AI Platform for Gigawatt Data Centers
- Planera Raises $8M for AI Data Center Scheduling
- Wiwynn Introduces Double-Wide Rack for AI at OCP Summit
- LG Electronics Boosts AI Infrastructure at Data Centre World Asia 2025
- ASUS Unveils AI Factory and Servers at OCP 2025
- ABB and Nvidia Partner on AI Data Centers
- Poolside and CoreWeave to Build Data Center in Texas
- Cerebras Systems to Equip UAE's Stargate AI Hub
- Oracle Introduces OCI Dedicated Region25
- ABB CEO Confident in AI Data Center Demand
- du and NextGenAI Expand AI Supercluster to Over 13MW
- Google to Invest $15 Billion in AI Hub in India
Chips & Hardware
GIGABYTE has unveiled its AI TOP ATOM supercomputer, featuring the NVIDIA Grace Blackwell GB10 Superchip, to enhance local AI development and support large-scale models globally from October 15, 2025. Meanwhile, InPsytech showcased its 3nm UCIe 3.0 technology at the OCP Global Summit 2025, highlighting advancements in chiplet technology with Alcor Micro.
- InPsytech Unveils 3nm UCIe 3.0 at OCP Summit 2025
- GIGABYTE Unveils AI TOP ATOM Supercomputer
- Advantech Unveils AOM-5721 Edge AI Module with Qualcomm SoC
- Jabil Unveils J-422G Servers for AI and Data Centers
- Axiado to Present AI Agents for Server Efficiency at OCP Summit
- DUV Lithography Market to Hit $23.69 Billion by 2031
- Broadcom Lays Off Employees After OpenAI Partnership
- Nvidia and Samsung Collaborate on AI CPUs and XPUs
- Fabric8Labs and Wiwynn Unveil ECAM Cold Plate Solutions at OCP Summit
- Dutch Government Takes Control of Nexperia
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