Fabric8Labs and Wiwynn to Showcase ECAM Cold Plates at OCP Global Summit 2025

San Diego–based Fabric8Labs announced its collaboration with Wiwynn to showcase next-generation Electrochemical Additive Manufacturing (ECAM) cold plate solutions at the OCP Global Summit 2025, according to a press release. The event takes place from October 13–16 at the San Jose Convention Center.

The companies will display a range of ECAM-enabled cold plates designed for high-performance AI servers. Demonstrations will include direct-to-chip single-phase and immersion cooling solutions, double-sided cold plates for dual-surface heat extraction, and two-phase plates with advanced wicking structures. A presentation at the Future Technologies Symposium will feature ECAM microchannel cold plates capable of handling heat fluxes above 350 W/cm².

Fabric8Labs’ ECAM process enables the production of custom geometries optimized for each chip’s power map, enhancing thermal management in data centers. The technology can reduce maximum chip temperatures by up to 8°C and improve temperature uniformity by 200%, supporting efficient cooling for GPUs and ASICs used in AI workloads.

Wiwynn stated that integrating ECAM technology allows the company to create customized microchannel cold plates, paving the way for future direct-to-silicon cooling designs and improving overall data center efficiency.