Flex Unveils Modular AI Data Center Platform at OCP Global Summit

October 13, 2025
Flex announced a globally manufactured, fully integrated data center platform at the OCP Global Summit, designed to accelerate AI and high-performance computing infrastructure deployments by up to 30%.

Flex announced a new AI and high-performance computing infrastructure platform at the OCP Global Summit, in a press release. The company described it as the first globally manufactured, fully integrated platform designed for gigawatt-scale data centers.

The platform combines power, cooling, compute, and services into modular, pre-engineered reference designs. This integration is intended to reduce deployment time by up to 30% and improve scalability for operators building next-generation AI and HPC facilities.

Flex said the system leverages its global manufacturing footprint and vertically integrated capabilities to help operators manage power and heat challenges at scale. The company is showcasing the new platform and related products at its OCP Global Summit booth B24.

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