Synopsys and TSMC Collaborate on AI and Multi-Die Design Solutions

September 24, 2025
Synopsys and TSMC have announced a collaboration to enhance AI and multi-die design solutions using TSMC's advanced processes and packaging technologies.

Synopsys and Taiwan Semiconductor Manufacturing Company Limited (TSMC) have announced a collaboration to enhance AI and multi-die design solutions using TSMC's advanced processes and packaging technologies. Announced in a press release, the partnership focuses on delivering multi-die solutions with advanced electronic design automation (EDA) and intellectual property (IP) products.

The collaboration includes certified digital and analog flows on TSMC's N2P and A16™ processes, utilizing TSMC NanoFlex™ architecture to boost performance and speed analog design migration. Synopsys' 3DIC Compiler platform and 3D-enabled IP facilitate multiple customer tape-outs using advanced 3D stacking and CoWoS packaging technologies.

Additionally, the partnership has resulted in an AI-optimized photonic flow for TSMC's Compact Universal Photonic Engine (TSMC-COUPE™) technology, enhancing system design performance and addressing multi-wavelength and thermal requirements. This collaboration aims to empower customers to deliver differentiated multi-die and AI designs with enhanced performance, lower power, and accelerated time to market.

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