T-Global and SiPearl to Develop Advanced Cooling Technologies for HPC Chips

T-Global Technology has partnered with SiPearl to develop high thermal conductivity materials and two-phase liquid cooling modules for high performance computing chips, announced in a press release. The project has been approved under Taiwan's Ministry of Economic Affairs' A+ Driving Industrial Innovation with AI Program.

The two-year research and development initiative focuses on creating advanced thermal management solutions for computing platforms used in AI, HPC, and data centers. T-Global will contribute its expertise in thermal materials, module design, and system validation, while SiPearl will provide its processor development capabilities.

The collaboration aims to enable higher chip performance and reduced energy consumption as computing heat flux continues to rise. According to the announcement, the partnership strengthens ties between Taiwan and France in semiconductor and cooling technology innovation.

SiPearl CEO Philippe Notton said the project enhances the company’s long-standing relationship with Taiwan’s semiconductor ecosystem and supports the development of efficient cooling systems for future computing architectures.