NEO Semiconductor Demonstrates 3D X-DRAM Proof of Concept and Gains Strategic Investment

April 23, 2026
NEO Semiconductor has announced successful proof-of-concept results for its 3D X-DRAM technology and secured a strategic investment led by Acer founder Stan Shih to advance AI memory development.
NEO Semiconductor Demonstrates 3D X-DRAM Proof of Concept and Gains Strategic Investment

NEO Semiconductor has announced successful proof-of-concept results for its 3D X-DRAM technology and secured a strategic investment led by Stan Shih, Founder and former Chairman and CEO of Acer, in a press release. The test chips confirmed that the technology can be produced using existing 3D NAND manufacturing processes while meeting key DRAM performance benchmarks.

The proof-of-concept was developed with National Yang Ming Chiao Tung University and fabricated and tested at the Taiwan Semiconductor Research Institute. The results showed read and write latency below 10 nanoseconds, data retention exceeding one second at 85°C, and endurance above 10¹⁴ cycles. These findings validate the manufacturability and electrical reliability of the architecture using mature semiconductor infrastructure.

The investment will fund further development, including multi-layer test chip design and collaborations with global memory companies. NEO Semiconductor plans to advance 3D X-DRAM toward commercialization as a scalable solution for high-density memory in AI and data-centric computing systems.

NEO's CEO Andy Hsu is scheduled to present detailed results at the Future of Memory and Storage conference in Santa Clara, California, in August 2026.

We hope you enjoyed this article.

Consider subscribing to one of our newsletters like Enterprise AI Brief, Silicon Brief or Daily AI Brief.

Also, consider following us on social media:

Enterprise AI AI Chips & Datacenters AI Brief AI Brief (X)

More from: Enterprise

04/23
OZMOSI and Planview Partner to Integrate AI Planning in Pharma R&D
04/23
Akeyless Appoints Yael Fainaro as Chief Strategy Officer to Expand AI Identity Security Ecosystem
04/23
VSBLTY and Brightside Partner on AI and Satellite Projects in the Philippines
04/23
Kaishun Digital and IBM Introduce Memory Optimization Solution for HPC Enterprises
04/23
QuesTek Innovations Names Michelle Campbell as Chief Commercial Officer

More from: Data Centers

04/23
M31 Completes eUSB2V2 Tapeout on TSMC N2P Process
04/23
Latin America Data Center Market to Reach $6.93 Billion by 2031
04/23
Skymizer Introduces HTX301 Inference Chip for Large Language Models
04/23
Kaishun Digital and IBM Introduce Memory Optimization Solution for HPC Enterprises
04/23
ECSite Integrates Automation Platform with VIAVI Fiber Test Systems for Hyperscale Data Centers

Subscribe to Silicon Brief

Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.

AI Token Webinar

Whitepaper

Stanford HAI’s 2025 AI Index Reveals Record Growth in AI Capabilities, Investment, and Regulation

The 2025 AI Index by Stanford HAI provides a comprehensive overview of the global state of artificial intelligence, highlighting significant advancements in AI capabilities, investment, and regulation. The report details improvements in AI performance, increased adoption in various sectors, and the growing global optimism towards AI, despite ongoing challenges in reasoning and trust. It serves as a critical resource for policymakers, researchers, and industry leaders to understand AI's rapid evolution and its implications.

Read more

You May Also Like