FotoNation and SEMIFIVE Partner on TriSilica AI Chip Development Using Samsung Foundry Process

May 11, 2026
FotoNation and SEMIFIVE have announced a collaboration to develop the TriSilica perceptual AI chip family, using Samsung Foundry’s 8nm process. The initial TS-210 chip is planned for a Multi-Project Wafer shuttle by the end of the year.

FotoNation and SEMIFIVE have announced a strategic collaboration for the turnkey development of TriSilica, FotoNation’s perceptual AI chip family, according to a press release.

Under the agreement, SEMIFIVE will lead the full development process for TriSilica, which is designed for low power sensor fusion in edge AI applications. The TriSilica platform supports multimodal sensor inputs such as audio, millimeter wave, spectral, infrared, and RGB.

The first product in the series, the TS-210, is scheduled for a Multi-Project Wafer shuttle at the end of the year. Fabrication will use Samsung Foundry's 8nm Low Power Ultimate process. This partnership marks SEMIFIVE’s first European project and expands its presence beyond Asia and North America.

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