M31 Completes eUSB2V2 Tapeout on TSMC N2P Process

Apr 23, 2026
M31 Technology has completed the tapeout of its eUSB2V2 interface IP on TSMC's N2P 2 nm process, marking a milestone in advanced node interface development focused on high-speed, low-power connectivity for AI, HPC, and mobile applications.

M31 Technology has completed the tapeout of its eUSB2V2 interface IP on Taiwan Semiconductor Manufacturing Company Limited's N2P process, announced in a press release. The milestone was shared during the TSMC 2026 North America Technology Symposium.

The eUSB2V2 IP was developed through co-optimization of design, circuit implementation, and physical layout to achieve improved performance and power efficiency while maintaining compatibility with the USB 2.0 ecosystem. It supports 1.2 V and 0.9 V low-voltage operation and strengthens the analog front end with programmable transmit de-emphasis and receiver equalization features.

Operating on TSMC's 2 nm N2P process, the eUSB2V2 IP supports data rates up to 4.8 Gbps and targets a power specification of 50 mW in standard mode. M31 stated that the IP is designed for applications requiring a balance of performance and power, including AI, high-performance computing, and mobile devices.

The company emphasized that the tapeout was achieved through close collaboration with TSMC on circuit tuning, platform design methodologies, and reference flows. M31 plans to extend its 2 nm expertise to future IP development for TSMC’s advanced process technologies.

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