Samsung Electro-Mechanics and NVIDIA Partner on ABF Substrate Supply

Oct 21, 2026
Samsung Electro-Mechanics and NVIDIA will jointly expand ABF substrate production in South Korea under a multiyear supply agreement.

Samsung Electro-Mechanics and NVIDIA will jointly invest in dedicated ABF package substrate production facilities, the companies said in a press release. Samsung Electro-Mechanics will supply substrates for NVIDIA compute chipsets and networking switches under a multiyear agreement beginning in 2026.

Samsung Electro-Mechanics will establish dedicated production lines at its manufacturing sites in Sejong and Busan, South Korea. The companies expect annual supply volumes to grow at a double digit rate, with NVIDIA accounting for a significant portion of the supplier's package substrate capacity by 2028.

The substrates will support AI processors and high speed networking equipment used for chip to chip connections in data centers. Samsung Electro-Mechanics said the products will use fine circuit patterning, warpage control, and embedded components such as multilayer ceramic capacitors and silicon capacitors.

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