TSMC weighs making 3D DRAM memory chips at Nvidia's request

TSMC is considering producing advanced memory chips after a request from Nvidia, Reuters reports, citing The Information. The chipmaker has started planning production of 3D DRAM, which stacks memory cells vertically to increase capacity.

TSMC could build new factories or acquire an existing plant and convert it for memory production. The timing of any production remains unclear, and TSMC and Nvidia did not immediately respond to requests for comment. The work is led by Hsu Kuo-chin, a TSMC vice president who oversees advanced packaging, The Next Web reported.

Entering the advanced memory market would put TSMC in competition with Samsung Electronics, SK Hynix and Micron. The companies supply memory used in AI systems amid limited availability and higher prices. A move into 3D DRAM could make TSMC's earnings more tied to the memory cycle, where prices swing with industry supply and demand, Finimize noted.