Corgi Semiconductor Photonics ETF Reaches $150 Million in Two Weeks

May 19, 2026
Corgi announced that its Lithography & Semiconductor Photonics ETF (EUV) has surpassed $150 million in assets under management less than two weeks after launch.

Corgi announced in a press release that its Lithography and Semiconductor Photonics ETF (Cboe BZX: EUV) has surpassed 150 million dollars in assets under management less than two weeks after launching on May 6, 2026.

The actively managed fund invests at least 80 percent of its net assets in companies involved in photonics and light based technologies. This includes sectors such as extreme ultraviolet lithography equipment, lasers, optical components, photonic integrated circuits, and optical networking equipment used in data centers and AI infrastructure.

As of May 18, 2026, the ETF held about 40 positions. Top holdings included Taiwan Semiconductor Manufacturing Co. (9.70 percent), ASML Holding (7.88 percent), Corning (5.03 percent), Lam Research (4.91 percent), Applied Materials (4.91 percent), and Lumentum (4.36 percent). The fund carries an expense ratio of 0.35 percent.

Corgi stated that the fund provides exposure to companies building the photonics and lithography technologies essential to advanced semiconductor manufacturing and communication systems.

We hope you enjoyed this article

Consider subscribing to one of our newsletters like Silicon Brief, Enterprise AI Brief or Daily AI Brief.

Also, consider following us on social media:

AI Chips & Datacenters Enterprise AI AI Brief AI Brief (X)
Free newsletter

Silicon Brief

Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.

AI Token Webinar

Whitepaper

Tensordyne Napier: What If One Rack Could Do the Work of Nine?

Tensordyne

This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.

Read more

You may also like

Free, six days a week

Daily AI Brief: the AI news that matters, in your inbox.