Park Systems and imec Begin Joint Metrology Program for Advanced Semiconductor Research

June 11, 2026
Park Systems has launched a joint development program with imec to create advanced metrology solutions for next generation semiconductor packaging and logic circuits.

Park Systems has begun a joint development program with imec to design new metrology solutions for semiconductor research, announced in a press release. The program will focus on measurement technologies for advanced 3D packaging and next generation logic circuits.

Park Systems will use its full range of products, including atomic force microscopy, white light interferometry, spectroscopic imaging ellipsometry, and digital holographic microscopy. Imec will provide samples based on its semiconductor roadmaps for testing and validation.

The two year program also includes Park Systems joining imec’s industrial affiliation program for 3D system integration. The collaboration coincides with the opening of Park Systems’ new global headquarters in Gwacheon, South Korea, where the company plans to expand its metrology capabilities for semiconductor manufacturing.

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