ACON OPTICS Showcases 1.6T and CPO Connectivity at COMPUTEX 2026

ACON OPTICS showcased its newest AI optical interconnect technologies at COMPUTEX 2026 under the theme "Shaping Next Generation Interconnect," announced in a press release. The company displayed its AI scale Co Packaged Optics (CPO) connectivity solutions, high precision Fiber Array Units, detachable optical connectivity products, and 1.6 terabit transceivers aimed at supporting emerging AI infrastructure and data center architectures.

At the event, ACON OPTICS highlighted its high density FAU and detachable optical systems designed for CPO architectures. These technologies are intended to enable scalable optical connectivity for AI computing environments. The company reported discussions with major industry participants such as NVIDIA, Intel, Cisco, Ayar Labs, AWS, and HPE on future optical interconnect designs and high bandwidth AI networking requirements.

A key feature of the exhibition was a joint demonstration of a MicroLED CPO optical interconnect solution created with Brillink and PlayNitride. The demonstration combined MicroLED light sources with advanced optical packaging and high density architectures to show potential improvements in optical communication for AI computing platforms.

The company also presented a range of AI data center interconnect products, including MPO optical connectivity, active optical cables, and direct attach cables designed for AI servers and high speed switches. In addition, ACON OPTICS introduced automotive optical transmission technologies for infotainment, driver assistance, and autonomous systems, emphasizing the growing role of optical connectivity in vehicle networks.