SK Telecom, Supermicro, and Schneider Electric Sign MOU for Modular AI Data Centers

March 04, 2026
SK Telecom has signed a memorandum of understanding with Supermicro and Schneider Electric to develop a pre-fabricated modular solution for AI data centers, aiming to reduce construction time and improve scalability.

SK Telecom has signed a three-party memorandum of understanding with Supermicro and Schneider Electric to develop a total solution for artificial intelligence data centers, announced in a press release. The agreement, signed at MWC 2026 in Barcelona, focuses on accelerating the deployment of AI data centers through a pre-fabricated modular design.

The companies plan to integrate AI computing servers with power and cooling infrastructure into single pre-manufactured modules. This approach allows data centers to be built using a building-block configuration, reducing construction timelines and costs compared to traditional methods. The modular design also enables phased deployment as demand increases, providing flexibility and scalability.

Under the MOU, SK Telecom will contribute operational expertise in AI data centers, Supermicro will supply high-performance GPU servers optimized for AI workloads, and Schneider Electric will provide mechanical, electrical, and plumbing infrastructure design and construction. The collaboration aims to support large-scale AI operations while addressing supply bottlenecks and cost efficiency.

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