Advancements in semiconductor technology, GPU development, and data center infrastructure that power AI computing capabilities.
Mercedes-Benz has launched Athos Silicon, a new chip company focused on developing energy-efficient semiconductors for autonomous vehicles, as announced in a press release by Athos Silicon.
Thoma Bravo has announced a strategic minority investment in SDC Capital Partners, a firm specializing in digital infrastructure, according to a press release.
QuickLogic Corporation has announced a $1 million contract for its embedded FPGA (eFPGA) Hard IP, aimed at a high-performance Data Center ASIC design, with delivery set for Q4 2025.
Microsoft has committed $33 billion to neocloud providers like Nebius and CoreWeave to address AI data center capacity shortages, according to Bloomberg.
Microsoft plans to primarily use its own custom-designed chips in its data centers, aiming to reduce reliance on Nvidia and AMD. This strategy is part of a broader effort to optimize AI workloads and address computing capacity shortages.
GS Microelectronics has acquired Muse Semiconductor, enhancing its capabilities in semiconductor design and production. The acquisition aims to expand GSME's reach across North America, Europe, and Asia.
SuperX AI Technology Limited has introduced the SuperX Modular AI Factory, a solution designed to reduce AI data center deployment time to under six months, announced in a press release.
IBM and AMD have announced a collaboration with Zyphra to deliver advanced AI infrastructure using AMD Instinct MI300X GPUs on IBM Cloud, as stated in a press release.
SEMIFIVE has received preliminary approval for its KOSDAQ listing, with Samsung Securities and UBS as joint lead underwriters.
OpenAI CEO Sam Altman met with South Korean President Lee Jae-myung to discuss a strategic partnership involving Samsung and SK Group to enhance AI infrastructure and semiconductor collaboration.
Silicom Ltd. has been awarded a Design Win for its FPGA Smart Card, expected to generate $2 million annually, announced in a press release.
Rebellions Inc., a South Korean AI chip startup, has raised $250 million in a Series C funding round, valuing the company at $1.4 billion, according to Bloomberg. The round included participation from Arm Holdings Plc and Samsung Ventures.
ShunYun Technology and NewPhotonics have announced a strategic partnership to manufacture photonic integrated circuits (PICs) at scale, addressing the growing demand for optical interconnect solutions in data centers.
UST and Kaynes Semicon have announced a joint venture to establish a Rs 3,300 crore semiconductor assembly and testing facility in Gujarat, India.
123NET has completed a major expansion of its Southfield DC1 Data Center, enhancing its capabilities for AI and data-intensive applications.
Fourier Cooling Solutions has announced the launch of its scalable, prefabricated data center solutions designed for AI and high-performance computing (HPC) environments.
Gemtek Technology Company Ltd has announced the OMDN-107 800Gbps DR Linear Pluggable Optics transceiver, designed for high-speed optical connectivity in AI and cloud data centers.
TELUS has launched Canada's first fully sovereign AI factory in Rimouski, Quebec, providing advanced AI computing resources while ensuring data sovereignty.
Anode has emerged from stealth with $9 million in seed funding led by Eclipse to accelerate the deployment of its AI-powered mobile microgrids.
Equinix has introduced its Distributed AI infrastructure to support the next wave of AI innovation, including agentic AI, as announced in a press release.
Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.
