NVIDIA Selects Micron for SOCAMM Memory Rollout

NVIDIA plans to deploy 600,000 to 800,000 SOCAMM modules in 2025, with Micron leading the production efforts, according to a press release by DIGITIMES ASIA.

NVIDIA is set to deploy between 600,000 and 800,000 SOCAMM modules in 2025, marking a significant step in the memory market. This initiative, announced in a press release, positions SOCAMM as a potential successor to high-bandwidth memory (HBM), with the company's GB300 "Blackwell" platform among the first to adopt this technology.

Micron Technology has emerged as the first memory maker approved for volume production of SOCAMM, outpacing competitors Samsung Electronics and SK Hynix. SOCAMM is designed for low-power, high-bandwidth AI computing, offering a 2.5x increase in bandwidth and a one-third reduction in size and power consumption compared to traditional RDIMM modules.

While the initial deployment will focus on AI servers and workstations, the inclusion of SOCAMM in the Digits AI PC indicates broader ambitions for the consumer market. This move could reshape dynamics in the substrate sector, as the module requires custom-designed PCBs, creating new demand opportunities for substrate suppliers.

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