Samsung to Begin HBM4 Chip Production for Nvidia in February

January 26, 2026
Samsung Electronics is set to start mass production of its next-generation HBM4 memory chips next month, with shipments expected to go to Nvidia after completing final qualification stages.

Samsung plans to begin mass production of its next-generation high-bandwidth memory chips, HBM4, in February. The chips are expected to be supplied to Nvidia after completing final qualification tests.

The company entered the final certification phase with Nvidia following the delivery of initial HBM4 samples in September. This generation of memory is designed for AI and high-performance computing applications, and will be paired with Nvidia’s upcoming Rubin processors, which the U.S. company has said are now in full production.

Samsung’s move marks progress in narrowing the gap with competitors SK Hynix and Micron, both of which are established suppliers of advanced memory chips for AI accelerators. Samsung and SK Hynix are expected to provide further details on HBM4 production and orders during their quarterly earnings announcements later this week.

Shares of Samsung rose in early trading following reports of the production timeline, while SK Hynix shares declined slightly on the same day.

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