DFI to Showcase Intel-Powered Edge AI Platforms at Embedded World 2026

DFI said it will showcase new edge AI platforms developed in collaboration with Intel at Embedded World 2026, announced in a press release. The company plans to demonstrate how edge AI is moving from pilot projects to scalable deployments across industrial and infrastructure environments.

Among the new products, DFI will unveil the PTH9HM COM-HPC Mini module for defense and unmanned systems. The module features Intel Core Ultra Series 3 processors with integrated Arc GPUs, supports real-time 8K vision processing, and operates across a wide temperature range. It includes 64GB LPDDR5x memory, PCIe Gen 5, dual 2.5GbE, and TPM 2.0 security for mission-critical operations.

For medical applications, DFI will introduce the PTH171 and PTH173 Mini-ITX motherboards, also powered by Intel Core Ultra Series 3 processors. These boards deliver up to 180 TOPS of AI performance and are designed for long-life-cycle medical imaging and diagnostic systems.

The company will also present the SF101-PTH compact system, which integrates CPU, GPU, and NPU components to support real-time control and AI inference. Incorporating Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), the system provides millisecond-level responsiveness without discrete GPUs, aimed at robotic and industrial automation use cases.

DFI said its collaboration with Intel combines edge AI technologies and industrial reliability to help customers transition from isolated demonstrations to production-ready deployments suitable for robotics, vision AI, and intelligent infrastructure.