Flex and LG Partner on Cooling Solutions for AI Data Centers

Nov 4, 2025
Flex and LG Electronics have announced a collaboration to develop integrated modular cooling technologies for gigawatt-scale AI data centers, combining their liquid and air-based thermal management systems to improve efficiency and scalability.
Flex and LG Partner on Cooling Solutions for AI Data Centers

Flex and LG Electronics will jointly develop integrated modular cooling solutions for gigawatt-scale AI data centers, announced in a press release. The collaboration aims to address growing thermal management challenges in high-density computing environments.

The partnership combines Flex’s liquid cooling portfolio, power products, and IT infrastructure with LG’s air and liquid cooling modules, including CRAC, CRAH, chillers, coolant distribution units (CDUs), and monitoring solutions. These systems will allow data center operators to customize and scale cooling infrastructure as demand increases.

According to Flex, the joint solutions will be offered as part of its AI infrastructure platform, which integrates power, cooling, compute, and services into modular designs. LG’s advanced chiller systems will produce cold water for data centers and interface with Flex and LG CDUs and secondary fluid networks to protect AI compute assets.

We hope you enjoyed this article

Consider subscribing to one of our newsletters like Silicon Brief or Daily AI Brief.

Also, consider following us on social media:

AI Chips & Datacenters AI Brief AI Brief (X)
Free newsletter

Silicon Brief

Weekly coverage of AI hardware developments including chips, GPUs, cloud platforms, and data center technology.

AI Token Webinar

Whitepaper

Tensordyne Napier: What If One Rack Could Do the Work of Nine?

Tensordyne

This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.

Read more

You may also like

Free, six days a week

Daily AI Brief: the AI news that matters, in your inbox.