Flex and LG Partner on Cooling Solutions for AI Data Centers

Flex and LG Electronics will jointly develop integrated modular cooling solutions for gigawatt-scale AI data centers, announced in a press release. The collaboration aims to address growing thermal management challenges in high-density computing environments.

The partnership combines Flex’s liquid cooling portfolio, power products, and IT infrastructure with LG’s air and liquid cooling modules, including CRAC, CRAH, chillers, coolant distribution units (CDUs), and monitoring solutions. These systems will allow data center operators to customize and scale cooling infrastructure as demand increases.

According to Flex, the joint solutions will be offered as part of its AI infrastructure platform, which integrates power, cooling, compute, and services into modular designs. LG’s advanced chiller systems will produce cold water for data centers and interface with Flex and LG CDUs and secondary fluid networks to protect AI compute assets.