Pelico to Support Boeing C-17 Maintenance with AI Platform

Jul 23, 2026
Pelico has signed a project agreement with Boeing to use its Manufacturing Orchestration Platform for C-17 Globemaster III maintenance operations, aiming to improve fleet readiness and operational efficiency.

Pelico has signed a strategic project agreement with Boeing to improve how C-17A Globemaster III heavy maintenance is planned and executed, announced in a press release.

Under the agreement, Boeing will implement Pelico's Manufacturing Orchestration Platform as a unified workspace to connect supply, engineering, planning, and depot operations. The AI enabled platform is intended to reduce depot cycle time, improve aircraft availability, and make delivery schedules more predictable by replacing spreadsheets with a shared real time view of maintenance priorities, bottlenecks, and material shortages.

The agreement follows a previous deployment of Pelico's platform in Boeing Global Services' commercial spare parts operations, where it was used to cut backlog and improve efficiency. The new project will extend those capabilities to Boeing’s military maintenance operations, providing visibility across supply, production, and repair to identify and resolve disruptions before they delay aircraft delivery.

We hope you enjoyed this article

Consider subscribing to one of our newsletters like Defense AI Brief, Enterprise AI Brief or Daily AI Brief.

Also, consider following us on social media:

Defense AI Brief Enterprise AI AI Brief AI Brief (X)
Free newsletter

Enterprise AI Brief

Weekly report on AI business applications, enterprise software releases, automation tools, and industry implementations.

Guide
Hosted Speech Recognition APIs

Hosted Speech Recognition APIs

Whitepaper

Tensordyne Napier: What If One Rack Could Do the Work of Nine?

Tensordyne

This Tensordyne whitepaper presents Napier, an inference-focused AI processor and rack-scale system based on the company’s TDN Math logarithmic number system. It examines infrastructure requirements for large mixture-of-experts and agentic models, compares major inference architecture approaches, and details the TDN AIP processor, TDN72 pod, TDN Link fabric, and Napier Ultra configuration. The paper reports simulation-based performance, cost, and accuracy-validation results, including Tensordyne’s projected comparison of one Napier rack with a nine-rack Nvidia Rubin plus Groq deployment; the chip is reported as taped out and in fabrication.

Read more

You may also like

Free, six days a week

Daily AI Brief: the AI news that matters, in your inbox.