Molex Invests in CAEPlus for AI Data Center Cooling

August 17, 2026
Molex has made a strategic investment in CAEPlus to support active liquid cooling technology for AI and high performance computing data centers.

Molex announced in a press release a strategic investment in CAEPlus, a company developing active liquid cooling technology for AI data centers.

The investment will support work on CAEPlus BoundaryCool platform, a compact active cooling architecture for GPU and ASIC thermal demands in AI and high performance computing data centers. BoundaryCool is designed to reduce CPU, GPU, and TPU chip temperatures compared with passive cold plate systems while remaining compatible with existing data center architectures.

Molex retains exclusive licensing to apply CAEPlus technology to its portfolio of pluggable I/O solutions.

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